View list of
  • All DSM grades
  • All PA6 grades
  • All grades beginning with A

CAMPUS® datasheet | Akulon® K-X04832


This datasheet of Akulon® K-X04832 from DSM Engineering Plastics is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:

  Akulon® K-X04832 | PA6-(GF+MD)30 | DSM Engineering Plastics
Product Texts
10% Glass Reinforced, 20% Mineral Reinforced, Heat Stabilized, High Flow

ISO 1043 PA6-(GF+MD)30

Akulon® polyamide 6 and 66 resins
Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 20 / * cm³/10min ISO 1133
Temperature 250 / * °C ISO 1133
Load 2.16 / * kg ISO 1133
Molding shrinkage (parallel) 0.3 / * % ISO 294-4, 2577
Molding shrinkage (normal) 0.9 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 7500 / 3500 MPa ISO 527-1/-2
Stress at break 110 / 55 MPa ISO 527-1/-2
Strain at break 2.3 / 5 % ISO 527-1/-2
Charpy impact strength (+23°C) 35 / 45 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 30 / 30 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 4 / 6 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 4 / 4 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 220 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 195 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 215 / * °C ISO 75-1/-2
Coeff. of linear therm. expansion (parallel) 35 / * E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 60 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 3.5 / 14 - IEC 60250
Relative permittivity (1MHz) 3.3 / 4.5 - IEC 60250
Dissipation factor (100Hz) 50 / 3200 E-4 IEC 60250
Dissipation factor (1MHz) 140 / 1200 E-4 IEC 60250
Volume resistivity 1E12 / 1E10 Ohm*m IEC 60093
Surface resistivity * / 1E13 Ohm IEC 60093
Comparative tracking index 500 / - - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 6.5 / * % Sim. to ISO 62
Humidity absorption 1.9 / * % Sim. to ISO 62
Density 1370 / - kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1170 kg/m³ -
Thermal conductivity of melt 0.32 W/(m K) -
Spec. heat capacity melt 2310 J/(kg K) -
Eff. thermal diffusivity 1.16E-7 m²/s -
Ejection temperature 178 °C -
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 1870 - ISO ....-2
Injection Molding, melt temperature 265 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Diagrams
Dynamic Shear modulus-temperature , Akulon® K-X04832, PA6-(GF+MD)30, DSM
Stress-strain , Akulon® K-X04832, PA6-(GF+MD)30, DSM
Stress-strain , Akulon® K-X04832, PA6-(GF+MD)30, DSM
Secant modulus-strain , Akulon® K-X04832, PA6-(GF+MD)30, DSM
Secant modulus-strain , Akulon® K-X04832, PA6-(GF+MD)30, DSM
Specific volume-temperature (pvT) , Akulon® K-X04832, PA6-(GF+MD)30, DSM
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
<font face="Arial" size="2">Injection Molding Recommendations
Disclaimer
 All information supplied by or on behalf of DSM in relation to its
products, whether in the nature of data, recommendations or otherwise,
is supported by research and, in good faith, believed reliable, but DSM
assumes no liability and makes no warranties of any kind, express or
implied, including, but not limited to, those of title, merchantability,
fitness for a particular purpose or non-infringement or any warranty
arising from a course of dealing, usage, or trade practice whatsoever
in respect of application, processing or use made of the aforementioned
information or product. The user assumes all responsibility for the use
of all information provided and shall verify quality and other properties or
any consequence from the use of all such information.

Typical values are indicative only and are not to be construed as being
binding specifications.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991