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This datasheet of Arnitel® EB464-01 from DSM Engineering Plastics is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Arnitel® EB464-01 | TPC | DSM Engineering Plastics
Product Texts
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 6.5 | cm³/10min | ISO 1133 |
| Temperature | 230 | °C | ISO 1133 |
| Load | 10 | kg | ISO 1133 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 75 | MPa | ISO 527-1/-2 |
| Stress at 50% strain | 11.8 | MPa | ISO 527-1/-2 |
| Stress at 10% elongation | 6.3 | MPa | ISO 527-1/-2 |
| Stress at 100% elongation | 14.9 | MPa | ISO 527-1/-2 |
| Stress at break TPE | 22 | MPa | ISO 527-1/-2 |
| Strain at break | >50 | % | ISO 527-1/-2 |
| Charpy notched impact strength (+23°C) | N | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | N | kJ/m² | ISO 179/1eA |
| Shore D hardness (15s) | 41 | - | ISO 868 |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 214 | °C | ISO 11357-1/-3 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.7 | % | Sim. to ISO 62 |
| Humidity absorption | 0.3 | % | Sim. to ISO 62 |
| Density | 1150 | kg/m³ | ISO 1183 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 1010 | kg/m³ | - |
| Thermal conductivity of melt | 0.193 | W/(m K) | - |
| Spec. heat capacity melt | 2220 | J/(kg K) | - |
| Eff. thermal diffusivity | 8.60E-8 | m²/s | - |
| Ejection temperature | 160 | °C | - |
Characteristics
Processing
Blow Molding
Delivery form
Pellets
Additives
Lubricants
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Disclaimer
All information supplied by or on behalf of DSM in relation to its products, whether in the nature of data, recommendations or otherwise, is supported by research and, in good faith, believed reliable, but DSM assumes no liability and makes no warranties of any kind, express or implied, including, but not limited to, those of title, merchantability, fitness for a particular purpose or non-infringement or any warranty arising from a course of dealing, usage, or trade practice whatsoever in respect of application, processing or use made of the aforementioned information or product. The user assumes all responsibility for the use of all information provided and shall verify quality and other properties or any consequence from the use of all such information. Typical values are indicative only and are not to be construed as being binding specifications.
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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991











