View list of
  • All DSM grades
  • All TPC grades
  • All grades beginning with A

CAMPUS® datasheet | Arnitel® EB464-01


This datasheet of Arnitel® EB464-01 from DSM Engineering Plastics is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:

  Arnitel® EB464-01 | TPC | DSM Engineering Plastics
Product Texts
38 Shore D, Antisqueak Blow Molding Grade

ISO 18064 TPC-ET

Arnitel® copolyester elastomers
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 6.5 cm³/10min ISO 1133
Temperature 230 °C ISO 1133
Load 10 kg ISO 1133
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 75 MPa ISO 527-1/-2
Stress at 50% strain 11.8 MPa ISO 527-1/-2
Stress at 10% elongation 6.3 MPa ISO 527-1/-2
Stress at 100% elongation 14.9 MPa ISO 527-1/-2
Stress at break TPE 22 MPa ISO 527-1/-2
Strain at break >50 % ISO 527-1/-2
Charpy notched impact strength (+23°C) N kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) N kJ/m² ISO 179/1eA
Shore D hardness (15s) 41 - ISO 868
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 214 °C ISO 11357-1/-3
Other propertiesValueUnitTest Standard
Water absorption 0.7 % Sim. to ISO 62
Humidity absorption 0.3 % Sim. to ISO 62
Density 1150 kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1010 kg/m³ -
Thermal conductivity of melt 0.193 W/(m K) -
Spec. heat capacity melt 2220 J/(kg K) -
Eff. thermal diffusivity 8.60E-8 m²/s -
Ejection temperature 160 °C -
Characteristics
Processing
Blow Molding
Delivery form
Pellets
Additives
Lubricants
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Disclaimer
 All information supplied by or on behalf of DSM in relation to its
products, whether in the nature of data, recommendations or otherwise,
is supported by research and, in good faith, believed reliable, but DSM
assumes no liability and makes no warranties of any kind, express or
implied, including, but not limited to, those of title, merchantability,
fitness for a particular purpose or non-infringement or any warranty
arising from a course of dealing, usage, or trade practice whatsoever
in respect of application, processing or use made of the aforementioned
information or product. The user assumes all responsibility for the use
of all information provided and shall verify quality and other properties or
any consequence from the use of all such information.

Typical values are indicative only and are not to be construed as being
binding specifications.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991