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This datasheet of CELANEX 2001 from Ticona is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
CELANEX 2001 | PBT | Ticona
Product Texts
Celanex 2001 is an unreinforced polybutylene terephthalate resin with
improved hydrolysis resistance developed for use in fiber optic buffer
tube applications. Celanex 2001 exhibits the high melt strength
required for profile extrusion.
improved hydrolysis resistance developed for use in fiber optic buffer
tube applications. Celanex 2001 exhibits the high melt strength
required for profile extrusion.
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 2600 | MPa | ISO 527-1/-2 |
| Yield stress | 60 | MPa | ISO 527-1/-2 |
| Yield strain | 6 | % | ISO 527-1/-2 |
| Nominal strain at break | >50 | % | ISO 527-1/-2 |
| Charpy notched impact strength (+23°C) | 7 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 4.2 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 225 | °C | ISO 11357-1/-3 |
| Glass transition temperature (10°C/min) | 60 | °C | ISO 11357-1/-2 |
| Temp. of deflection under load (1.80 MPa) | 50 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 150 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 185 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 130 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 88 | E-6/K | ISO 11359-1/-2 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 3 | - | IEC 60250 |
| Relative permittivity (1MHz) | 3.2 | - | IEC 60250 |
| Dissipation factor (1MHz) | 200 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | >1E15 | Ohm | IEC 60093 |
| Electric strength | 15 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 600 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.45 | % | Sim. to ISO 62 |
| Humidity absorption | 0.19 | % | Sim. to ISO 62 |
| Density | 1310 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Processing conditions acc. ISO | 7790 | - | ISO ....-2 |
| Injection Molding, melt temperature | 243 | °C | ISO 294 |
| Injection Molding, mold temperature | 82 | °C | ISO 10724 |
| Injection Molding, injection velocity | 300 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 48 | MPa | ISO 294 |
Characteristics
Processing
Injection Molding, Profile Extrusion, Other Extrusion
Delivery form
Pellets
Regional Availability
Other text information
Injection molding
PREPROCESSING
To avoid hydrolytic degradation during processing, CELANEX resins have
to be dried to a moisture level equal to or less than 0.02%. Drying
should be done in a dehumidifying hopper dryer capable of dewpoints
<-30°F (-34°C) at 250°F (121°C) for 4 hours.
PROCESSING
Rear Temperature 450-470(230-240) deg F (deg C)
Center Temperature 460-480(235-250) deg F (deg C)
Front Temperature 470-500(240-260) deg F (deg C)
Nozzle Temper ature 480-500(250-260) deg F (deg C)
Melt Temperature 460-500(235-260) deg F (deg C)
Mold Temperature 150-200(65-93) deg F (deg C)
Back Pressure 0-50 psi
Screw Speed Medium
Injection Speed Fast
Injection speed, injection pressure and holding pressure have to be
optimized to the individual article geometry. To avoid material
degradation during processing low back pressure and minimum screw speed
have to be used. Ov erheating of the material has to be avoided, in
particular for flame retardant grades. Up to 25% clean and dry regrind
may be used.
POSTPROCESSING
To avoid hydrolytic degradation during processing, CELANEX resins have
to be dried to a moisture level equal to or less than 0.02%. Drying
should be done in a dehumidifying hopper dryer capable of dewpoints
<-30°F (-34°C) at 250°F (121°C) for 4 hours.
PROCESSING
Rear Temperature 450-470(230-240) deg F (deg C)
Center Temperature 460-480(235-250) deg F (deg C)
Front Temperature 470-500(240-260) deg F (deg C)
Nozzle Temper ature 480-500(250-260) deg F (deg C)
Melt Temperature 460-500(235-260) deg F (deg C)
Mold Temperature 150-200(65-93) deg F (deg C)
Back Pressure 0-50 psi
Screw Speed Medium
Injection Speed Fast
Injection speed, injection pressure and holding pressure have to be
optimized to the individual article geometry. To avoid material
degradation during processing low back pressure and minimum screw speed
have to be used. Ov erheating of the material has to be avoided, in
particular for flame retardant grades. Up to 25% clean and dry regrind
may be used.
POSTPROCESSING
Disclaimer
NOTICE TO USERS: Values shown are based on testing of laboratory test specimens and represent data that fall within the standard range of properties for natural material. These values alone do not represent a sufficient basis for any part design and are not intended for use in establishing maximum, minimum, or ranges of values for specification purposes. Colorants or other additives may cause significant variations in data values. Properties of molded parts can be influenced by a wide variety of factors including, but not limited to, material selection, additives, part design, processing conditions and environmental exposure. Any determination of the suitability of a particular material and part design for any use contemplated by the users and the manner of such use is the sole responsibility of the users, who must assure themselves that the material as subsequently processed meets the needs of their particular product or use. To the best of our knowledge, the information contained in this publication is accurate; however, we do not assume any liability whatsoever for the accuracy and completeness of such information. The information contained in this publication should not be construed as a promise or guarantee of specific properties of our products. It is the sole responsibility of the users to investigate whether any existing patents are infringed by the use of the materials mentioned in this publication. Moreover, there is a need to reduce human exposure to many materials to the lowest practical limits in view of possible adverse effects. To the extent that any hazards may have been mentioned in this publication, we neither suggest nor guarantee that such hazards are the only ones which exist. We recommend that persons intending to rely on any recommendation or to use any equipment, processing technique, or material mentioned in this publication should satisfy themselves that they can meet all applicable safety and health standards. We strongly recommend that users seek and adhere to the manufacturer's current instructions for handling each material they use, and to entrust the handling of such material to adequately trained personnel only. Please call the telephone numbers listed for additional technical information. Call Customer Services for the appropriate Materials Safety Data Sheets (MSDS) before attempting to process our products. The products mentioned herein are not intended for use in medical or dental implants.
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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991











