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CAMPUS® Datasheet | CELANEX 2002-2

This datasheet of CELANEX 2002-2 from Ticona is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:

CELANEX 2002-2 | PBT | Celanese
Product Texts
Celanex 2002-2 is a general purpose, unreinforced polybutylene
terephthalate with a good balance of mechanical properties and
processability. Celanex 2002-2 ia a medium flow material that contains
an internal lubricant.
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 20 cm³/10min ISO 1133
Temperature 250 °C ISO 1133
Load 2.16 kg ISO 1133
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2600 MPa ISO 527-1/-2
Yield stress 60 MPa ISO 527-1/-2
Yield strain 4 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Charpy impact strength, -30°C 190 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 6 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 6 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature, 10°C/min 225 °C ISO 11357-1/-3
Glass transition temperature, 10°C/min 60 °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 55 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 150 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 190 °C ISO 306
Coeff. of linear therm. expansion, parallel 110 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 127 E-6/K ISO 11359-1/-2
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.7 mm IEC 60695-11-10
Oxygen index 22 % ISO 4589-1/-2
Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 4 - IEC 60250
Relative permittivity, 1MHz 3.5 - IEC 60250
Dissipation factor, 100Hz 14 E-4 IEC 60250
Dissipation factor, 1MHz 220 E-4 IEC 60250
Volume resistivity 1E13 Ohm*m IEC 60093
Surface resistivity 1E15 Ohm IEC 60093
Electric strength 23 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.45 % Sim. to ISO 62
Density 1310 kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 243 °C ISO 294
Injection Molding, mold temperature 82 °C ISO 10724
Injection Molding, injection velocity 300 mm/s ISO 294
Injection Molding, pressure at hold 48 MPa ISO 294
Viscosity-shear rate, CELANEX 2002-2, PBT, Celanese
Shearstress-shear rate, CELANEX 2002-2, PBT, Celanese
Dynamic Shear modulus-temperature, CELANEX 2002-2, PBT, Celanese
Stress-strain, CELANEX 2002-2, PBT, Celanese
Secant modulus-strain, CELANEX 2002-2, PBT, Celanese
Injection Molding
Delivery form
Regional Availability
Other text information
Injection molding
To avoid hydrolytic degradation during processing, CELANEX resins have
to be dried to a moisture level equal to or less than 0.02%. Drying
should be done in a dehumidifying hopper dryer capable of dewpoints
<-30°F (-34°C) at 250°F (121°C) for 4 hours.

Rear Temperature 450-470(230-240) deg F (deg C)
Center Temperature 460-480(235-250) deg F (deg C)
Front Temperature 470-500(240-260) deg F (deg C)
Nozzle Temper ature 480-500(250-260) deg F (deg C)
Melt Temperature 460-500(235-260) deg F (deg C)
Mold Temperature 150-200(65-93) deg F (deg C)
Back Pressure 0-50 psi
Screw Speed Medium
Injection Speed Fast

Injection speed, injection pressure and holding pressure have to be
optimized to the individual article geometry. To avoid material
degradation during processing low back pressure and minimum screw speed
have to be used. Ov erheating of the material has to be avoided, in
particular for flame retardant grades. Up to 25% clean and dry regrind
may be used.

NOTICE TO USERS: Values shown are based on testing of laboratory test specimens and represent data that fall within the standard range of properties for natural material. These values alone do not represent a sufficient basis for any part design and are not intended for use in establishing maximum, minimum, or ranges of values for specification purposes. Colorants or other additives may cause significant variations in data values.

Properties of molded parts can be influenced by a wide variety of factors including, but not limited to, material selection, additives, part design, processing conditions and environmental exposure. Any determination of the suitability of a particular material and part design for any use contemplated by the users and the manner of such use is the sole responsibility of the users, who must assure themselves that the material as subsequently processed meets the needs of their particular product or use.

To the best of our knowledge, the information contained in this publication is accurate; however, we do not assume any liability whatsoever for the accuracy and completeness of such information. The information contained in this publication should not be construed as a promise or guarantee of specific properties of our products. It is the sole responsibility of the users to investigate whether any existing patents are infringed by the use of the materials mentioned in this publication.

Moreover, there is a need to reduce human exposure to many materials to the lowest practical limits in view of possible adverse effects. To the extent that any hazards may have been mentioned in this publication, we neither suggest nor guarantee that such hazards are the only ones which exist. We recommend that persons intending to rely on any recommendation or to use any equipment, processing technique, or material mentioned in this publication should satisfy themselves that they can meet all applicable safety and health standards.

We strongly recommend that users seek and adhere to the manufacturer's current instructions for handling each material they use, and to entrust the handling of such material to adequately trained personnel only. Please call the telephone numbers listed for additional technical information. Call Customer Services for the appropriate Materials Safety Data Sheets (MSDS) before attempting to process our products.

The products mentioned herein are not intended for use in medical or dental implants.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2014
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