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CAMPUS® datasheet | CELANEX 2500


This datasheet of CELANEX 2500 from Ticona is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  CELANEX 2500 | PBT | Ticona
Product Texts
Chemical abbreviation according to ISO 1043-1: PBT
Moulding compound ISO 7792- PBT, MGHR, 08-030N

Polybutylene terephthalate, easy flow, nucleated grade

Flammability UL 94 HB Minimum thickness 1.0 mm.

Recognition by Underwriters Laboratories, USA (UL)
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 40 cm³/10min ISO 1133
Temperature 250 °C ISO 1133
Load 2.16 kg ISO 1133
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2700 MPa ISO 527-1/-2
Yield stress 60 MPa ISO 527-1/-2
Yield strain 4 % ISO 527-1/-2
Nominal strain at break 15 % ISO 527-1/-2
Tensile creep modulus (1h) 2400 MPa ISO 899-1
Tensile creep modulus (1000h) 1600 MPa ISO 899-1
Charpy impact strength (+23°C) 135 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 130 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 5 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 4.5 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 225 °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 60 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 160 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 190 °C ISO 306
Coeff. of linear therm. expansion (parallel) 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 1.0 mm IEC 60695-11-10
UL recognition UL - -
Oxygen index 22 % ISO 4589-1/-2
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 3.9 - IEC 60250
Relative permittivity (1MHz) 3.8 - IEC 60250
Dissipation factor (100Hz) 13 E-4 IEC 60250
Dissipation factor (1MHz) 200 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity >1E15 Ohm IEC 60093
Electric strength 23 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.45 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1310 kg/m³ ISO 1183
Material specific propertiesValueUnitTest Standard
Viscosity number 85 cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1110 kg/m³ -
Thermal conductivity of melt 0.133 W/(m K) -
Spec. heat capacity melt 1920 J/(kg K) -
Ejection temperature 219 °C -
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 7790 - ISO ....-2
Injection Molding, melt temperature 265 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Diagrams
Viscosity-shear rate , CELANEX 2500, PBT, Ticona
Shearstress-shear rate , CELANEX 2500, PBT, Ticona
Dynamic Shear modulus-temperature , CELANEX 2500, PBT, Ticona
Stress-strain , CELANEX 2500, PBT, Ticona
Secant modulus-strain , CELANEX 2500, PBT, Ticona
Stress-strain (isochronous) 23°C, CELANEX 2500, PBT, Ticona
Creep modulus-time 23°C, CELANEX 2500, PBT, Ticona
Stress-strain (isochronous) 60°C, CELANEX 2500, PBT, Ticona
Creep modulus-time 60°C, CELANEX 2500, PBT, Ticona
Stress-strain (isochronous) 100°C, CELANEX 2500, PBT, Ticona
Creep modulus-time 100°C, CELANEX 2500, PBT, Ticona
Specific volume-temperature (pvT) , CELANEX 2500, PBT, Ticona
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING

To avoid hydrolytic degradation during processing, CELANEX resins have
to be dried to a moisture level equal to or less than 0,02%. The drying
should be done in a dry-air dryer (dew point < -30°C) with a
temperature of 120 to 140 °C and a drying time of 2 to 4 hours. In case
of longer residence times in the dry-air dryer, the temperature should
be reduced to 100°C.
The time between drying and processing should be kept as short as
possible. The processing machine feed hopper should be closed during
the processing operation.

PROCESSING

Melt Temperature 250-260 °C
Mold Temperature 75-85 °C
Maximum Barrel Residence Time *) 5-10 min
Injection Speed fast
Peripheral screw speed max.0,3 m/sec
Back Pressure 10-30 bar
Injection Pressure 600-1000 bar
Holding Pressure 400-800 bar
Nozzle Design open design preferred

Injection speed, injection pressure and holding pressure have to be
optimized to the individual article geometry. To avoid material
degradation during processing low back pressure and minimum screw speed
have to be used. Overheating of the material has to be avoided. For
grades containing flam e retardants, a maximum temperature of 265 °C
should not be exceeded.

Ticona recommends only externally heated hot runner systems.

*) If the cylinder temperatures are higher than the recommended maximum
temperatures, the max. residence time in the barrel has to be reduced.

POSTPROCESSING
Disclaimer
NOTICE TO USERS: Values shown are based on testing
of laboratory test specimens and represent data that fall
within the standard range of properties for natural material.
These values alone do not represent a sufficient basis for
any part design and are not intended for use in
establishing maximum, minimum, or ranges of values for
specification purposes. Colorants or other additives may
cause significant variations in data values.

Properties of molded parts can be influenced by a wide
variety of factors including, but not limited to, material
selection, additives, part design, processing conditions and
environmental exposure. Any determination of the
suitability of a particular material and part design for any
use contemplated by the users and the manner of such
use is the sole responsibility of the users, who must assure
themselves that the material as subsequently processed
meets the needs of their particular product or use.

To the best of our knowledge, the information contained in
this publication is accurate; however, we do not assume
any liability whatsoever for the accuracy and completeness
of such information. The information contained in this
publication should not be construed as a promise or
guarantee of specific properties of our products. It is the
sole responsibility of the users to investigate whether any
existing patents are infringed by the use of the materials
mentioned in this publication.

Moreover, there is a need to reduce human exposure to
many materials to the lowest practical limits in view of
possible adverse effects. To the extent that any hazards
may have been mentioned in this publication, we neither
suggest nor guarantee that such hazards are the only ones
which exist. We recommend that persons intending to rely
on any recommendation or to use any equipment,
processing technique, or material mentioned in this
publication should satisfy themselves that they can meet
all applicable safety and health standards.

We strongly recommend that users seek and adhere to the
manufacturer's current instructions for handling each
material they use, and to entrust the handling of such
material to adequately trained personnel only. Please call
the telephone numbers listed for additional technical
information. Call Customer Services for the appropriate
Materials Safety Data Sheets (MSDS) before attempting to
process our products.

The products mentioned herein are not intended for use in
medical or dental implants.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991