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offers extended functionality!CAMPUS® datasheet | CELCON CF802
This datasheet of CELCON CF802 from Ticona is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
CELCON CF802 | POM | Ticona
Product Texts
Celcon® acetal copolymer grade CF802 is a conductive, fuel compatible
general purpose acetal copolymer. Celcon® CF802 has been developed to
dissipate static electricity from fuel handling systems.
Please note Celcon® CF802 has special processing considerations to
ensure static dissipation properties. Use minimum back pressure and
slowest screw speed possible in retracting screw during cooling portion
of cycle. Large gate size (>2 mm) recommended. Pneumatic conveying of
material long distances is not recommended.
general purpose acetal copolymer. Celcon® CF802 has been developed to
dissipate static electricity from fuel handling systems.
Please note Celcon® CF802 has special processing considerations to
ensure static dissipation properties. Use minimum back pressure and
slowest screw speed possible in retracting screw during cooling portion
of cycle. Large gate size (>2 mm) recommended. Pneumatic conveying of
material long distances is not recommended.
| Rheological properties | Value | Unit | Test Standard |
| Molding shrinkage (parallel) | 1.7 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 1.6 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 3100 | MPa | ISO 527-1/-2 |
| Tensile creep modulus (1h) | 2130 | MPa | ISO 899-1 |
| Tensile creep modulus (1000h) | 1050 | MPa | ISO 899-1 |
| Charpy impact strength (+23°C) | 70 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 70 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 4.5 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 4.1 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 167 | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 100 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 161 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 100 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 120 | E-6/K | ISO 11359-1/-2 |
| Electrical properties | Value | Unit | Test Standard |
| Volume resistivity | 3 | Ohm*m | IEC 60093 |
| Surface resistivity | 2000 | Ohm | IEC 60093 |
| Other properties | Value | Unit | Test Standard |
| Density | 1470 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Processing conditions acc. ISO | 9990 | - | ISO ....-2 |
| Injection Molding, melt temperature | 205 | °C | ISO 294 |
| Injection Molding, mold temperature | 90 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 86 | MPa | ISO 294 |
Diagrams
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Regional Availability
Other text information
Injection molding
PREPROCESSING
Drying is generally not required because Celcon® and Hostaform® acetal
copolymers are not hydroscopic nor are they degraded by moisture during
processing. Excessive moisture can lead to splay (silver streaking) in
molded parts. For better uniformity in molding especially when using
regrind or material that has been stored in containers open to the
atmosphere, recommended drying conditions are 80 C (180 F) for 3hours.
Desiccant hopper dryers are not required. Maximum water content = 0.35%
PROCESSING
Standard reciprocating screw injection molding machines with a high
compression screw (minimum 3:1 and preferably 4:1) and low back
pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw
(I.E. general purpose 2:1 compression ratio) can result in unmelted
particles and poor melt homogeneity. Using a high back pressure to make
up for a low compression ratio may lead to excessive shear he ating and
deterioration of the material.
Melt Temperature: Preferred range 182-199 C (360-390 F). Melt
temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F)
especially with wall thickness less than 1.5 mm (0.060 in.). May
require mold temperature as high as 120 C (250 F) to reproduce mold
surface or to assure minimal molded in stress. Wall thickness greater
than 3mm (1/8 in.) may use a coole r (65 C/150 F) mold surface
temperature and wall thickness over 6mm (1/4 in.) may use a cold mold
surface down to 25 C (80 F). In general, mold surface temperatures
lower than 82 C (180 F) may hinder weld line formation and produce a
hazy surface or a surface with flow lines, pits and other included
defects that can hinder part performance.
POSTPROCESSING
Postprocessing conditioning and moisturizing are not required. It may
be necessary to fixture large or complicated parts with varying wall
thickness to prevent warpage while cooling to ambient temperature.
Drying is generally not required because Celcon® and Hostaform® acetal
copolymers are not hydroscopic nor are they degraded by moisture during
processing. Excessive moisture can lead to splay (silver streaking) in
molded parts. For better uniformity in molding especially when using
regrind or material that has been stored in containers open to the
atmosphere, recommended drying conditions are 80 C (180 F) for 3hours.
Desiccant hopper dryers are not required. Maximum water content = 0.35%
PROCESSING
Standard reciprocating screw injection molding machines with a high
compression screw (minimum 3:1 and preferably 4:1) and low back
pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw
(I.E. general purpose 2:1 compression ratio) can result in unmelted
particles and poor melt homogeneity. Using a high back pressure to make
up for a low compression ratio may lead to excessive shear he ating and
deterioration of the material.
Melt Temperature: Preferred range 182-199 C (360-390 F). Melt
temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F)
especially with wall thickness less than 1.5 mm (0.060 in.). May
require mold temperature as high as 120 C (250 F) to reproduce mold
surface or to assure minimal molded in stress. Wall thickness greater
than 3mm (1/8 in.) may use a coole r (65 C/150 F) mold surface
temperature and wall thickness over 6mm (1/4 in.) may use a cold mold
surface down to 25 C (80 F). In general, mold surface temperatures
lower than 82 C (180 F) may hinder weld line formation and produce a
hazy surface or a surface with flow lines, pits and other included
defects that can hinder part performance.
POSTPROCESSING
Postprocessing conditioning and moisturizing are not required. It may
be necessary to fixture large or complicated parts with varying wall
thickness to prevent warpage while cooling to ambient temperature.
Disclaimer
NOTICE TO USERS: Values shown are based on testing of laboratory test specimens and represent data that fall within the standard range of properties for natural material. These values alone do not represent a sufficient basis for any part design and are not intended for use in establishing maximum, minimum, or ranges of values for specification purposes. Colorants or other additives may cause significant variations in data values. Properties of molded parts can be influenced by a wide variety of factors including, but not limited to, material selection, additives, part design, processing conditions and environmental exposure. Any determination of the suitability of a particular material and part design for any use contemplated by the users and the manner of such use is the sole responsibility of the users, who must assure themselves that the material as subsequently processed meets the needs of their particular product or use. To the best of our knowledge, the information contained in this publication is accurate; however, we do not assume any liability whatsoever for the accuracy and completeness of such information. The information contained in this publication should not be construed as a promise or guarantee of specific properties of our products. It is the sole responsibility of the users to investigate whether any existing patents are infringed by the use of the materials mentioned in this publication. Moreover, there is a need to reduce human exposure to many materials to the lowest practical limits in view of possible adverse effects. To the extent that any hazards may have been mentioned in this publication, we neither suggest nor guarantee that such hazards are the only ones which exist. We recommend that persons intending to rely on any recommendation or to use any equipment, processing technique, or material mentioned in this publication should satisfy themselves that they can meet all applicable safety and health standards. We strongly recommend that users seek and adhere to the manufacturer's current instructions for handling each material they use, and to entrust the handling of such material to adequately trained personnel only. Please call the telephone numbers listed for additional technical information. Call Customer Services for the appropriate Materials Safety Data Sheets (MSDS) before attempting to process our products. The products mentioned herein are not intended for use in medical or dental implants.
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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991











