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offers extended functionality!CAMPUS® datasheet | CELCON M15HP
This datasheet of CELCON M15HP from Ticona is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
CELCON M15HP | POM | Ticona
Product Texts
Celcon® acetal copolymer grade M15HP is a creep resistant, high
viscosity polymer
providing optimum performance in general purpose injection molding.
This grade provides overall excellent performance in applications
requiring high stiffness.
Chemical abbreviation according to ISO 1043-1: POM
viscosity polymer
providing optimum performance in general purpose injection molding.
This grade provides overall excellent performance in applications
requiring high stiffness.
Chemical abbreviation according to ISO 1043-1: POM
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 1.3 | cm³/10min | ISO 1133 |
| Temperature | 190 | °C | ISO 1133 |
| Load | 2.16 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 2.3 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 1.9 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 2800 | MPa | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 280 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 235 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 11 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 8.5 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 173 | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 101 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 158 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 166 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 110 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 120 | E-6/K | ISO 11359-1/-2 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.75 | % | Sim. to ISO 62 |
| Humidity absorption | 0.2 | % | Sim. to ISO 62 |
| Density | 1400 | kg/m³ | ISO 1183 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 1170 | kg/m³ | - |
| Test specimen production | Value | Unit | Test Standard |
| Processing conditions acc. ISO | 9990 | - | ISO ....-2 |
| Injection Molding, melt temperature | 210 | °C | ISO 294 |
| Injection Molding, mold temperature | 100 | °C | ISO 10724 |
| Injection Molding, injection velocity | 140 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 86 | MPa | ISO 294 |
Diagrams
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Other Extrusion, Blow Molding, Calandering
Delivery form
Pellets
Regional Availability
Other text information
Injection molding
PREPROCESSING
Drying is generally not required because Celcon® and Hostaform® acetal
copolymer materials are not hydroscopic nor are they degraded by
moisture during processing. Excessive moisture can lead to splay
(silver streaking) in molded parts. For better uniformity in molding
especially when using regrind or material that has been stored in
containers open to the atmosphere, recommended drying conditions are 80
c (180 F) for three hours. Desiccant hopper dryers are not required.
Max. water content = 0.35%.
PROCESSING
Standard reciprocating screw injection molding machines with a high
compression screw (minimum 3:1 and preferably 4:1) and low back
pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw
(i.e.-general purpose with a 2:1 compression ratio) can result in
unmelted particles and poor thermal homogeneity. Using a high back
pressure to make up for a low compression ratio may lead to excessive
shear heating and deterioration of the Celcon material.
Melt temperature: Preferred range 205-220 C (400-430 F) Melt
temperature should never exceed 230 C (450 F).
Mold surface temperature: preferred range 93-121 C (200-250 F)
especially with wall thickness less than 1.5 mm (0.060 in.). Wall
thickness greater than 3 mm (1/8 in.) may use a cooler (82 C/180 F)
mold surface temperature and wall thickness over 6 mm (1/4 in.) may use
a cold mold surface temperature as low as 25 C (80 F). In general, mold
surface temperatures lower than 82 C (180 F) may produce a hazy surface
or a surface with flow lines, pits and other included defects.
POSTPROCESSING
Postprocessing conditioning and moisturizing not required. It may be
necessary to fixture large or complicated parts with varying wall
thickness to prevent warpage while cooling to ambient temperature.
Drying is generally not required because Celcon® and Hostaform® acetal
copolymer materials are not hydroscopic nor are they degraded by
moisture during processing. Excessive moisture can lead to splay
(silver streaking) in molded parts. For better uniformity in molding
especially when using regrind or material that has been stored in
containers open to the atmosphere, recommended drying conditions are 80
c (180 F) for three hours. Desiccant hopper dryers are not required.
Max. water content = 0.35%.
PROCESSING
Standard reciprocating screw injection molding machines with a high
compression screw (minimum 3:1 and preferably 4:1) and low back
pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw
(i.e.-general purpose with a 2:1 compression ratio) can result in
unmelted particles and poor thermal homogeneity. Using a high back
pressure to make up for a low compression ratio may lead to excessive
shear heating and deterioration of the Celcon material.
Melt temperature: Preferred range 205-220 C (400-430 F) Melt
temperature should never exceed 230 C (450 F).
Mold surface temperature: preferred range 93-121 C (200-250 F)
especially with wall thickness less than 1.5 mm (0.060 in.). Wall
thickness greater than 3 mm (1/8 in.) may use a cooler (82 C/180 F)
mold surface temperature and wall thickness over 6 mm (1/4 in.) may use
a cold mold surface temperature as low as 25 C (80 F). In general, mold
surface temperatures lower than 82 C (180 F) may produce a hazy surface
or a surface with flow lines, pits and other included defects.
POSTPROCESSING
Postprocessing conditioning and moisturizing not required. It may be
necessary to fixture large or complicated parts with varying wall
thickness to prevent warpage while cooling to ambient temperature.
Film extrusion
PREPROCESSING
Drying is generally not required because Celcon materials are not
hydroscopic nor are they degraded by moisture during processing.
Excessive moisture can cause surface defects on the extruded film. For
better uniformity especially when using regrind or material that has
been stored in containers open to the atmosphere, recommended drying
conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not
required. Max. moisture content = 0. 35%.
PROCESSING
Standard extruders with a length to diameter ratio of at least 20:1 are
recommended. The screw should be a high compression ratio of at least
3:1 and preferably 4:1 to assure good melting and melt homogeneity. The
design should be approximately 35% each for feed and metering sections
with the remaining 30% as the transition zone.
Melt temperature: 160-220 C (320-430 F)
POSTPROCESSING
Postprocessing conditioning or moistur izing is not required.
Drying is generally not required because Celcon materials are not
hydroscopic nor are they degraded by moisture during processing.
Excessive moisture can cause surface defects on the extruded film. For
better uniformity especially when using regrind or material that has
been stored in containers open to the atmosphere, recommended drying
conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not
required. Max. moisture content = 0. 35%.
PROCESSING
Standard extruders with a length to diameter ratio of at least 20:1 are
recommended. The screw should be a high compression ratio of at least
3:1 and preferably 4:1 to assure good melting and melt homogeneity. The
design should be approximately 35% each for feed and metering sections
with the remaining 30% as the transition zone.
Melt temperature: 160-220 C (320-430 F)
POSTPROCESSING
Postprocessing conditioning or moistur izing is not required.
Profile extrusion
PREPROCESSING
Drying is generally not required because Celcon materials are not
hydroscopic nor are they degraded by moisture during processing.
Excessive moisture can cause surface defects on the extrusion. For
better uniformity especially when using regrind or material that has
been stored in containers open to the atmosphere, recommended drying
conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not
required. Max. moisture content = 0.035% .
PROCESSING
Standard extruders with a length to diameter ratio of at least 20:1 are
recommended. The screw should be a high compression ratio of at least
3:1 and preferably 4:1 to assure good melting and melt homogeneity. The
design should be approximately 35% each for feed and metering sections
with the remaining 30% as the transition zone.
Melt temperature: 180-220 C (360-430 F).
POSTPROCESSING
Postprocessing or moisturizing is not re quired. For thick walled
extrusions (>3 mm or 1/8 in.), annealing is recommended to reduce
internal stresses.
Annealing temperature: 130-140 C (265-285 F)
Annealing time: 10 min/mm thickness
Drying is generally not required because Celcon materials are not
hydroscopic nor are they degraded by moisture during processing.
Excessive moisture can cause surface defects on the extrusion. For
better uniformity especially when using regrind or material that has
been stored in containers open to the atmosphere, recommended drying
conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not
required. Max. moisture content = 0.035% .
PROCESSING
Standard extruders with a length to diameter ratio of at least 20:1 are
recommended. The screw should be a high compression ratio of at least
3:1 and preferably 4:1 to assure good melting and melt homogeneity. The
design should be approximately 35% each for feed and metering sections
with the remaining 30% as the transition zone.
Melt temperature: 180-220 C (360-430 F).
POSTPROCESSING
Postprocessing or moisturizing is not re quired. For thick walled
extrusions (>3 mm or 1/8 in.), annealing is recommended to reduce
internal stresses.
Annealing temperature: 130-140 C (265-285 F)
Annealing time: 10 min/mm thickness
Blow molding
PREPROCESSING
Consult product information services.
PROCESSING
Consult product information services.
POSTPROCESSING
Consult product information services.
Consult product information services.
PROCESSING
Consult product information services.
POSTPROCESSING
Consult product information services.
Calandering
PREPROCESSING
Consult product information services.
PROCESSING
Consult product information services.
POSTPROCESSING
Consult product information services.
Consult product information services.
PROCESSING
Consult product information services.
POSTPROCESSING
Consult product information services.
Compression molding
PREPROCESSING
Consult product information services.
PROCESSING
Consult product information services.
POSTPROCESSING
Consult product information services.
Consult product information services.
PROCESSING
Consult product information services.
POSTPROCESSING
Consult product information services.
Disclaimer
NOTICE TO USERS: Values shown are based on testing of laboratory test specimens and represent data that fall within the standard range of properties for natural material. These values alone do not represent a sufficient basis for any part design and are not intended for use in establishing maximum, minimum, or ranges of values for specification purposes. Colorants or other additives may cause significant variations in data values. Properties of molded parts can be influenced by a wide variety of factors including, but not limited to, material selection, additives, part design, processing conditions and environmental exposure. Any determination of the suitability of a particular material and part design for any use contemplated by the users and the manner of such use is the sole responsibility of the users, who must assure themselves that the material as subsequently processed meets the needs of their particular product or use. To the best of our knowledge, the information contained in this publication is accurate; however, we do not assume any liability whatsoever for the accuracy and completeness of such information. The information contained in this publication should not be construed as a promise or guarantee of specific properties of our products. It is the sole responsibility of the users to investigate whether any existing patents are infringed by the use of the materials mentioned in this publication. Moreover, there is a need to reduce human exposure to many materials to the lowest practical limits in view of possible adverse effects. To the extent that any hazards may have been mentioned in this publication, we neither suggest nor guarantee that such hazards are the only ones which exist. We recommend that persons intending to rely on any recommendation or to use any equipment, processing technique, or material mentioned in this publication should satisfy themselves that they can meet all applicable safety and health standards. We strongly recommend that users seek and adhere to the manufacturer's current instructions for handling each material they use, and to entrust the handling of such material to adequately trained personnel only. Please call the telephone numbers listed for additional technical information. Call Customer Services for the appropriate Materials Safety Data Sheets (MSDS) before attempting to process our products. The products mentioned herein are not intended for use in medical or dental implants.
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