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CAMPUS® datasheet | EDISTIR® SR 550


This datasheet of EDISTIR® SR 550 from Polimeri Europa is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Rheological calculation properties - Test specimen production - Diagrams
  EDISTIR® SR 550 | PS-I | Polimeri Europa
Product Texts
Symbol according to ISO 1043-1: PS-I

Designation: Thermoplastics ISO 2897-PS-I,M,083-12-07-18

High impact, easy flow polystyrene with good elasticity at low temperatures.

Suitable for injection moulding of large or complex parts with low thickness and high impact strength.


Applications:

Toys, housewares, technical items.

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Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 11.5 cm³/10min ISO 1133
Temperature 200 °C ISO 1133
Load 5 kg ISO 1133
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 1900 MPa ISO 527-1/-2
Yield stress 18.5 MPa ISO 527-1/-2
Yield strain 1.2 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Charpy impact strength, +23°C N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 8.5 kJ/m² ISO 179/1eA
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Thermal propertiesValueUnitTest Standard
Glass transition temperature, 10°C/min 88 °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 68 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 83 °C ISO 306
Coeff. of linear therm. expansion, parallel 90 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.0 mm IEC 60695-11-10
UL recognition UL - -
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Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 2.5 - IEC 60250
Relative permittivity, 1MHz 2.5 - IEC 60250
Dissipation factor, 100Hz 3 E-4 IEC 60250
Dissipation factor, 1MHz 3 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity >1E15 Ohm IEC 60093
Electric strength 65 kV/mm IEC 60243-1
Comparative tracking index 500 - IEC 60112
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Other propertiesValueUnitTest Standard
Water absorption 0.06 % Sim. to ISO 62
Humidity absorption 0.04 % Sim. to ISO 62
Density 1040 kg/m³ ISO 1183
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Rheological calculation propertiesValueUnitTest Standard
Density of melt 950 kg/m³ -
Spec. heat capacity of melt 2050 J/(kg K) -
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Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 2900 - ISO ....-2
Injection Molding, melt temperature 220 °C ISO 294
Injection Molding, mold temperature 45 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
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Diagrams
Viscosity-shear rate , EDISTIR® SR 550, PS-I, Polimeri
Shearstress-shear rate , EDISTIR® SR 550, PS-I, Polimeri
Dynamic Shear modulus-temperature , EDISTIR® SR 550, PS-I, Polimeri
Stress-strain , EDISTIR® SR 550, PS-I, Polimeri
Secant modulus-strain , EDISTIR® SR 550, PS-I, Polimeri
Specific volume-temperature (pvT) , EDISTIR® SR 550, PS-I, Polimeri
Spec. enthalpy/mass-temp. (DSC) , EDISTIR® SR 550, PS-I, Polimeri
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Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding, Thermoforming
Delivery form
Pellets
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Injection molding
0 Injection Molding
PREPROCESSING

Drying normally not required

 

PROCESSING

Typical processing temperature range:

    Melt temperature         200 - 250 °C

    Mold temperature          20  - 60 °C

Film extrusion
PREPROCESSING

Drying normally not required

 

PROCESSING

Melt temperature              210 -240 °C

Other extrusion
PREPROCESSING

Drying normally not required

 

PROCESSING

Melt temperature              210 -240 °C

Profile extrusion
PREPROCESSING

Drying normally not required

 

PROCESSING

Melt temperature              210 -240 °C

Sheet extrusion
PREPROCESSING

Drying normally not required

 

PROCESSING

Melt temperature              210 -240 °C

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Disclaimer
Dear CAMPUS User,

The data, information and suggestions are provided for guidance
purpose only.
The Company accepts no responsibility for the results obtained
therefrom, as neither for their utilisation in infringement of
possible patents rights.
All indicated data refer to natural grades.
On the subject of the experimental products, the Company reserves the
right to change without prewarning the characteristics, to optimise
the performances.

If you have any questions regarding CAMPUS, please send
an e-mail to:Pe Campus


For further information regarding Polimeri Europa:
	Polimeri Europa Homepage
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CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012