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CAMPUS® datasheet | HOSTAFORM C 2521


This datasheet of HOSTAFORM C 2521 from Ticona is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  HOSTAFORM C 2521 | POM | Ticona
Product Texts
Chemical abbreviation according to ISO 1043-1: POM
Molding compound ISO 9988- POM-K, M-GNR, 01-002

POM copolymer

Stiff-flowing type for injection molding and extrusion with high
impact toughness and good tracking resistance over a high range of
temperature; good chemical resistance to solvents, fuel and strong
alkalis as well as good hydrolysis resistance; high resistance to
thermal and oxidative degradation.

Fulfils EG-directive 2002/72/EU as well as the recommendation
XXXIII for consumer goods of the BgVV
FDA compliant according to 21 CFR 177.2470

Burning rate ISO 3795 and FMVSS 302 < 75 mm/min for a thickness more
than 1 mm.

Ranges of applications: injection molding thick-walled, void-free
molded parts; extrusion e.g. for boards and pipes.

FDA = Food and Drug Administration (USA)
BgVV = Bundesinstitut fr gesundheitlichen Verbraucherschutz und
Veterin rmedizin
FMVSS = Federal Motor Vehicle Safety Standard (USA)
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 2.5 cm³/10min ISO 1133
Temperature 190 °C ISO 1133
Load 2.16 kg ISO 1133
Molding shrinkage (parallel) 2.1 % ISO 294-4, 2577
Molding shrinkage (normal) 1.8 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2600 MPa ISO 527-1/-2
Yield stress 62 MPa ISO 527-1/-2
Yield strain 9 % ISO 527-1/-2
Nominal strain at break 32 % ISO 527-1/-2
Tensile creep modulus (1h) 2300 MPa ISO 899-1
Tensile creep modulus (1000h) 1100 MPa ISO 899-1
Charpy impact strength (+23°C) 220[P] kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 200 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 8.5 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 7 kJ/m² ISO 179/1eA
P: Partial Break
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 165 °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 101 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 151 °C ISO 306
Coeff. of linear therm. expansion (parallel) 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.0 mm IEC 60695-11-10
UL recognition UL - -
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 4 - IEC 60250
Relative permittivity (1MHz) 4 - IEC 60250
Dissipation factor (100Hz) 15 E-4 IEC 60250
Dissipation factor (1MHz) 50 E-4 IEC 60250
Volume resistivity 1E12 Ohm*m IEC 60093
Surface resistivity 1E14 Ohm IEC 60093
Electric strength 35 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.65 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1410 kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1200 kg/m³ -
Thermal conductivity of melt 0.155 W/(m K) -
Spec. heat capacity melt 2210 J/(kg K) -
Ejection temperature 165 °C -
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 9990 - ISO ....-2
Injection Molding, melt temperature 205 °C ISO 294
Injection Molding, mold temperature 90 °C ISO 10724
Injection Molding, injection velocity 140 mm/s ISO 294
Injection Molding, pressure at hold 90 MPa ISO 294
Diagrams
Viscosity-shear rate , HOSTAFORM C 2521, POM, Ticona
Shearstress-shear rate , HOSTAFORM C 2521, POM, Ticona
Dynamic Shear modulus-temperature , HOSTAFORM C 2521, POM, Ticona
Stress-strain , HOSTAFORM C 2521, POM, Ticona
Secant modulus-strain , HOSTAFORM C 2521, POM, Ticona
Stress-strain (isochronous) 23°C, HOSTAFORM C 2521, POM, Ticona
Creep modulus-time 23°C, HOSTAFORM C 2521, POM, Ticona
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding
Delivery form
Pellets
Additives
Release agent
Regional Availability
Other text information
Injection molding
PREPROCESSING

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %



PROCESSING

Standard injection moulding machines with three phase (15 to 25 D)
plasticating screws will fit.

Melt tempera ture 190-230 °C
Mould temperature 80-120 °C

POSTPROCESSING

Conditioning e.g. moisturizing is not necessary.
Film extrusion
PREPROCESSING

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %




PROCESSING

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C




POSTPROCESSING

Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Other extrusion
PREPROCESSING

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %




PROCESSING

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C




POSTPROCESSING

Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Profile extrusion
PREPROCESSING

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %




PROCESSING

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C




POSTPROCESSING

Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Sheet extrusion
PREPROCESSING

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %




PROCESSING

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C




POSTPROCESSING

Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Blow molding
PREPROCESSING

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %




PROCESSING

Standard extruders with plasticating screws (20 to 25 D) will fit.

Melt temperature 180-190 °C
Mould-surface temperature 60-100 °C




POSTPROCESSING

Conditioning e.g. moisturizing is not necessary.
Disclaimer
NOTICE TO USERS: Values shown are based on testing
of laboratory test specimens and represent data that fall
within the standard range of properties for natural material.
These values alone do not represent a sufficient basis for
any part design and are not intended for use in
establishing maximum, minimum, or ranges of values for
specification purposes. Colorants or other additives may
cause significant variations in data values.

Properties of molded parts can be influenced by a wide
variety of factors including, but not limited to, material
selection, additives, part design, processing conditions and
environmental exposure. Any determination of the
suitability of a particular material and part design for any
use contemplated by the users and the manner of such
use is the sole responsibility of the users, who must assure
themselves that the material as subsequently processed
meets the needs of their particular product or use.

To the best of our knowledge, the information contained in
this publication is accurate; however, we do not assume
any liability whatsoever for the accuracy and completeness
of such information. The information contained in this
publication should not be construed as a promise or
guarantee of specific properties of our products. It is the
sole responsibility of the users to investigate whether any
existing patents are infringed by the use of the materials
mentioned in this publication.

Moreover, there is a need to reduce human exposure to
many materials to the lowest practical limits in view of
possible adverse effects. To the extent that any hazards
may have been mentioned in this publication, we neither
suggest nor guarantee that such hazards are the only ones
which exist. We recommend that persons intending to rely
on any recommendation or to use any equipment,
processing technique, or material mentioned in this
publication should satisfy themselves that they can meet
all applicable safety and health standards.

We strongly recommend that users seek and adhere to the
manufacturer's current instructions for handling each
material they use, and to entrust the handling of such
material to adequately trained personnel only. Please call
the telephone numbers listed for additional technical
information. Call Customer Services for the appropriate
Materials Safety Data Sheets (MSDS) before attempting to
process our products.

The products mentioned herein are not intended for use in
medical or dental implants.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991