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CAMPUS® datasheet | HOSTAFORM EC270TX


This datasheet of HOSTAFORM EC270TX from Ticona is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  HOSTAFORM EC270TX | POM | Ticona
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 1.5 cm³/10min ISO 1133
Temperature 190 °C ISO 1133
Load 2.16 kg ISO 1133
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 1950 MPa ISO 527-1/-2
Yield stress 44 MPa ISO 527-1/-2
Yield strain 11 % ISO 527-1/-2
Nominal strain at break 15 % ISO 527-1/-2
Charpy notched impact strength (+23°C) 6.5 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 166 °C ISO 11357-1/-3
Electrical propertiesValueUnitTest Standard
Volume resistivity 10 Ohm*m IEC 60093
Surface resistivity 1000 Ohm IEC 60093
Other propertiesValueUnitTest Standard
Density 1380 kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 9990 - ISO ....-2
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Regional Availability
Other text information
Injection molding
PREPROCESSING
Drying is highly recommended for conductive carbon based ESD grades of
Hostaform®. Excessive moisture can lead to splay (silver streaking) in
molded parts. For better uniformity in molding especially when using
regrind or material that has been stored in containers open to the
atmosphere, recommended drying conditions are 80 C (180 F) for 3 hours.
Desiccant hopper dryers are not required. Maximum water content = 0.35%

PROCESSING
Stan dard reciprocating screw injection molding machines with a high
compression screw (minimum 3:1 and preferably 4:1) and low back
pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw
(I.E. general purpose 2:1 compression ratio) can result in unmelted
particles and poor melt homogeneity. Using a high back pressure to make
up for a low compression ratio may lead to excessive shear heating and
deterioration of the Hostaform® material.

Melt Temp erature: Preferred range 182-199 C (360-390 F). Melt
temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F)
especially with wall thickness less than 1.5 mm (0.060 in.). May
require mold temperature as high as 120 C (250 F) to reproduce mold
surface or to assure minimal molded in stress. Wall thickness greater
than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface
temperature and wall thickness over 6mm (1/4 in.) may use a cold mold
surface down to 25 C (80 F). In general, mold surface temperatures
lower than 82 C (180 F) may produce a hazy surface or a surface with
flow lines, pits and other included defects.

POSTPROCESSING
Postprocessing conditioning and moisturizing are not required. It may
be necessary to fixture large or complicated parts with varying wall
thickness to prevent warpage while cooling to ambient temperature.
Disclaimer
NOTICE TO USERS: Values shown are based on testing
of laboratory test specimens and represent data that fall
within the standard range of properties for natural material.
These values alone do not represent a sufficient basis for
any part design and are not intended for use in
establishing maximum, minimum, or ranges of values for
specification purposes. Colorants or other additives may
cause significant variations in data values.

Properties of molded parts can be influenced by a wide
variety of factors including, but not limited to, material
selection, additives, part design, processing conditions and
environmental exposure. Any determination of the
suitability of a particular material and part design for any
use contemplated by the users and the manner of such
use is the sole responsibility of the users, who must assure
themselves that the material as subsequently processed
meets the needs of their particular product or use.

To the best of our knowledge, the information contained in
this publication is accurate; however, we do not assume
any liability whatsoever for the accuracy and completeness
of such information. The information contained in this
publication should not be construed as a promise or
guarantee of specific properties of our products. It is the
sole responsibility of the users to investigate whether any
existing patents are infringed by the use of the materials
mentioned in this publication.

Moreover, there is a need to reduce human exposure to
many materials to the lowest practical limits in view of
possible adverse effects. To the extent that any hazards
may have been mentioned in this publication, we neither
suggest nor guarantee that such hazards are the only ones
which exist. We recommend that persons intending to rely
on any recommendation or to use any equipment,
processing technique, or material mentioned in this
publication should satisfy themselves that they can meet
all applicable safety and health standards.

We strongly recommend that users seek and adhere to the
manufacturer's current instructions for handling each
material they use, and to entrust the handling of such
material to adequately trained personnel only. Please call
the telephone numbers listed for additional technical
information. Call Customer Services for the appropriate
Materials Safety Data Sheets (MSDS) before attempting to
process our products.

The products mentioned herein are not intended for use in
medical or dental implants.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991