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This datasheet of KYNAR 740 from ARKEMA is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
KYNAR 740 | PVDF | ARKEMA
Product Texts
DESIGNATION ISO 12086-PVDF-E,GG1N,P.?E7.I.E.E.C,, ?(7-15) KYNAR PVDF are fluorinated thermoplastic homopolymers. Outstanding characteristics of KYNAR : chemical resistance, imperviousness to UV, high barrier properties, high purity, good mechanical and thermomechanical properties. Main applications of KYNAR: corrosion protection in the chemical industry, coating (painting, coextrusion), off shore, wire and cable. KYNAR 740 is a standard grade of granules for extrusion of tubes and plaques, compression and transfer moulding.This product is ANSI/NSF Standard 61 certified. Powder form available as KYNAR 741.
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 1.1 | cm³/10min | ISO 1133 |
| Temperature | 230 | °C | ISO 1133 |
| Load | 5 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 2.0 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 2.0 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 1700 | MPa | ISO 527-1/-2 |
| Yield stress | 50 | MPa | ISO 527-1/-2 |
| Yield strain | 7 | % | ISO 527-1/-2 |
| Nominal strain at break | >50 | % | ISO 527-1/-2 |
| Tensile creep modulus (1h) | 1050 | MPa | ISO 899-1 |
| Tensile creep modulus (1000h) | 570 | MPa | ISO 899-1 |
| Charpy impact strength (+23°C) | 244 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 186 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 14 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 5 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 168 | °C | ISO 11357-1/-3 |
| Glass transition temperature (10°C/min) | -40 | °C | ISO 11357-1/-2 |
| Temp. of deflection under load (1.80 MPa) | 105 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 135 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 135 | °C | ISO 306 |
| Burning Behav. at 1.5 mm nom. thickn. | V-0 | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| UL recognition | UL | - | - |
| Burning Behav. at thickness h | V-0 | class | IEC 60695-11-10 |
| Thickness tested | 0.8 | mm | IEC 60695-11-10 |
| Oxygen index | 43 | % | ISO 4589-1/-2 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 11 | - | IEC 60250 |
| Relative permittivity (1MHz) | 8 | - | IEC 60250 |
| Dissipation factor (100Hz) | 260 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | 2310 | E-4 | IEC 60250 |
| Volume resistivity | 2E12 | Ohm*m | IEC 60093 |
| Surface resistivity | >1E15 | Ohm | IEC 60093 |
| Electric strength | 21 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 600 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.03 | % | Sim. to ISO 62 |
| Humidity absorption | 0.015 | % | Sim. to ISO 62 |
| Density | 1780 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 230 | °C | ISO 294 |
| Injection Molding, mold temperature | 90 | °C | ISO 10724 |
| Injection Molding, injection velocity | 10 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 13 | MPa | ISO 294 |
| Compression Molding, molding temperature | 225 | °C | ISO 293 |
| Compression Molding, molding time | 3 | min | ISO 293 |
| Compression Molding, demolding temperature | 120 | °C | ISO 293 |
Diagrams
Characteristics
Processing
Profile Extrusion, Sheet Extrusion, Other Extrusion, Transfer Molding, Thermoforming
Delivery form
Pellets
Special Characteristics
Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Regional Availability
Other text information
Profile extrusion
PROCESSING
Melt temperature : 220-230 °C
Notice text : Due to the important shrinkage rules must be
: strictly followed for the calculation of the
: equipment dimensions(sizer, die and mandrel).
: See our notice "processing".
POSTPROCESSING
Annealing
-Temperature : 150 °C
-Time : 1 h
Sheet extrusion
PROCESSING Melt temperature : 220-230 °C Notice text : cylinders temperature : 115-130°C
Compression molding
PROCESSING
Mold temperature : 190-220 °C
Molding pressure : 9- 15 MPa
Notice text : Compression molding must be done during a short
: time (2 to 3minutes) , with a high pressure at a
: precise temperature.
: Due to the important shrinkage, during cooling it
: is imperative to maintain a precise temperature of
: 155°C under a 8 MPa pressure for a duration of
: 1 hour by 20 mm thickness of the shape.
: (see our notice "processing").
Chemical Media Resistance
Disclaimer
This database provides the main properties of technical thermoplastics
marketed by ARKEMA.
The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.
For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991