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CAMPUS® datasheet | Luran® S 777 K


This datasheet of Luran® S 777 K from Styrolution Group GmbH is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Rheological calculation properties - Test specimen production - Diagrams
  Luran® S 777 K | ASA | Styrolution Group GmbH
Product Texts
Easy flowing injection moulding grade with good toughness and heat distortion resistance.
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Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 15 cm³/10min ISO 1133
Temperature 220 °C ISO 1133
Load 10 kg ISO 1133
Molding shrinkage, parallel 0.5 % ISO 294-4, 2577
Molding shrinkage, normal 0.9 % ISO 294-4, 2577
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2300 MPa ISO 527-1/-2
Yield stress 48 MPa ISO 527-1/-2
Yield strain 3.3 % ISO 527-1/-2
Nominal strain at break 9 % ISO 527-1/-2
Tensile creep modulus, 1h 1850 MPa ISO 899-1
Tensile creep modulus, 1000h 1400 MPa ISO 899-1
Charpy impact strength, +23°C 250 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 90 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 17 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 4 kJ/m² ISO 179/1eA
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Thermal propertiesValueUnitTest Standard
Temp. of deflection under load, 1.80 MPa 97 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 101 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 97 °C ISO 306
Coeff. of linear therm. expansion, parallel 95 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
UL recognition UL - -
Oxygen index 19 % ISO 4589-1/-2
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Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 3.7 - IEC 60250
Relative permittivity, 1MHz 3.4 - IEC 60250
Dissipation factor, 100Hz 110 E-4 IEC 60250
Dissipation factor, 1MHz 240 E-4 IEC 60250
Volume resistivity 1E12 Ohm*m IEC 60093
Surface resistivity 1E13 Ohm IEC 60093
Electric strength 35 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
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Other propertiesValueUnitTest Standard
Water absorption 1.65 % Sim. to ISO 62
Humidity absorption 0.35 % Sim. to ISO 62
Density 1070 kg/m³ ISO 1183
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Rheological calculation propertiesValueUnitTest Standard
Thermal conductivity of melt 0.16 W/(m K) -
Spec. heat capacity of melt 1860 J/(kg K) -
Ejection temperature 95 °C -
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 250 °C ISO 294
Injection Molding, mold temperature 60 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
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Diagrams
Viscosity-shear rate , Luran® S 777 K, ASA, Styrolution
Shearstress-shear rate , Luran® S 777 K, ASA, Styrolution
Stress-strain , Luran® S 777 K, ASA, Styrolution
Secant modulus-strain , Luran® S 777 K, ASA, Styrolution
Stress-strain (isochronous) 23°C, Luran® S 777 K, ASA, Styrolution
Creep modulus-time 23°C, Luran® S 777 K, ASA, Styrolution
Specific volume-temperature (pvT) , Luran® S 777 K, ASA, Styrolution
Tensile modulus-temperature , Luran® S 777 K, ASA, Styrolution
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Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 2 - 4 h

PROCESSING
injection molding, Melt temperature, range: 240 - 280 °C
injection molding, Melt temperature, recommended: 250 °C
injection molding, Mold temperature, range: 40 - 80 °C
injection molding, Mold temperature, recommended: 60 °C
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Chemical Media Resistance
Acids
Acetic Acid (5% by mass) (23°C)
Citric Acid solution (10% by mass) (23°C)
Lactic Acid (10% by mass) (23°C)
Hydrochloric Acid (36% by mass) (23°C)
Nitric Acid (40% by mass) (23°C)
Sulfuric Acid (38% by mass) (23°C)
Sulfuric Acid (5% by mass) (23°C)
Chromic Acid solution (40% by mass) (23°C)
Bases
Sodium Hydroxide solution (35% by mass) (23°C)
Sodium Hydroxide solution (1% by mass) (23°C)
Ammonium Hydroxide solution (10% by mass) (23°C)
Alcohols
Isopropyl alcohol (23°C)
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
n-Hexane (23°C)
Toluene (23°C)
iso-Octane (23°C)
Ketones
Acetone (23°C)
Ethers
Diethyl ether (23°C)
Mineral oils
SAE 10W40 multigrade motor oil (23°C)
Salt solutions
Sodium Chloride solution (10% by mass) (23°C)
Sodium Hypochlorite solution (10% by mass) (23°C)
Sodium Carbonate solution (20% by mass) (23°C)
Zinc Chloride solution (50% by mass) (23°C)
Other
Ethyl Acetate (23°C)
Water (23°C)
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Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact

Styrolution GmbH
Styrolution Infopoint
mailto:styrenics.infopoint@basf.com
Tel: +49 621 60 41446

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
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CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012