View list of
  • All DSM grades
  • All PA66 grades
  • All grades beginning with N

CAMPUS® datasheet | Nylatron® GS


This datasheet of Nylatron® GS from DSM Engineering Plastics is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:

  Nylatron® GS | PA66 | DSM Engineering Plastics
Product Texts
MoS2 Lubricated

ISO 1043 PA66
Rheological propertiesdry / condUnitTest Standard
Molding shrinkage (normal) 1.4 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 3600 / 1500 MPa ISO 527-1/-2
Yield stress 95 / 60 MPa ISO 527-1/-2
Yield strain 3.5 / 20 % ISO 527-1/-2
Nominal strain at break 10 / 25 % ISO 527-1/-2
Charpy notched impact strength (+23°C) 4.7 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 260 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 85 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 230 / * °C ISO 75-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.5 / * mm IEC 60695-11-10
UL recognition UL / * - -
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 1.5 / * mm IEC 60695-11-10
UL recognition UL / * - -
Other propertiesdry / condUnitTest Standard
Water absorption 8.5 / * % Sim. to ISO 62
Humidity absorption 2.3 / * % Sim. to ISO 62
Density 1160 / * kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 1870 - ISO ....-2
Injection Molding, melt temperature 290 °C ISO 294
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Regional Availability
Disclaimer
 All information supplied by or on behalf of DSM in relation to its
products, whether in the nature of data, recommendations or otherwise,
is supported by research and, in good faith, believed reliable, but DSM
assumes no liability and makes no warranties of any kind, express or
implied, including, but not limited to, those of title, merchantability,
fitness for a particular purpose or non-infringement or any warranty
arising from a course of dealing, usage, or trade practice whatsoever
in respect of application, processing or use made of the aforementioned
information or product. The user assumes all responsibility for the use
of all information provided and shall verify quality and other properties or
any consequence from the use of all such information.

Typical values are indicative only and are not to be construed as being
binding specifications.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991