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CAMPUS® datasheet | ORGALLOY LE 60THM


This datasheet of ORGALLOY LE 60THM from ARKEMA is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:

  ORGALLOY LE 60THM | PA6... | ARKEMA
Product Texts
ORGALLOY LE 60THM - LE 60HM - LE 6000

LE series, flexible polyamide alloys: processability on PE screw, low 
moisture absorption, chemical resistance (no known solvents).

The grades referenced: higher in rigidity than LE 6000. For film, hollow 
vessel blow moulding and for injection moulding.

LE 6000  - Flexural modulus:  900 MPa.
LE 60HM  - Flexural modulus: 1200 MPa.
LE 60THM - Flexural modulus: 1400 MPa.
Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 3 / * cm³/10min ISO 1133
Temperature 235 / * °C ISO 1133
Load 2.16 / * kg ISO 1133
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus - / 1750 MPa ISO 527-1/-2
Yield stress - / 40 MPa ISO 527-1/-2
Yield strain - / 5 % ISO 527-1/-2
Nominal strain at break - / >50 % ISO 527-1/-2
Tensile creep modulus (1h) * / 1520 MPa ISO 899-1
Tensile creep modulus (1000h) * / 690 MPa ISO 899-1
Charpy notched impact strength (+23°C) - / 23 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 220 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 50 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 80 / * °C ISO 75-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Surface resistivity * / >1E15 Ohm IEC 60093
Comparative tracking index * / 600 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 6 / * % Sim. to ISO 62
Humidity absorption 1.8 / * % Sim. to ISO 62
Density 1050 / 1050 kg/m³ ISO 1183
Film Propertiesdry / condUnitTest Standard
Stress at yield (parallel) 35 / * MPa ISO 527-3
Stress at yield (normal) 35 / * MPa ISO 527-3
Strain at yield (parallel) 16 / * % ISO 527-3
Strain at yield (normal) 16 / * % ISO 527-3
Maximum stress (parallel) 61 / * MPa ISO 527-3
Maximum stress (normal) 55 / * MPa ISO 527-3
Maximum strain (parallel) 610 / * % ISO 527-3
Maximum strain (normal) 550 / * % ISO 527-3
Elmendorf Tear resistance (parallel) 45 / * N ISO 6383-2
Elmendorf Tear resistance (normal) 55 / * N ISO 6383-2
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 60 °C ISO 10724
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding, Calandering, Transfer Molding, Thermoforming
Delivery form
Pellets
Special Characteristics
Platable, Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING
 

Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING

Melt temperature :      240-280 °C
Mold temperature :       40- 80 °C

Notice text      :      To avoid degradation, it is recommended to limit
                 :      injection moulding temperature to 300°C.

                 :      A higher mould temperature leads to higher shrinkage..

POSTPROCESSING

Annealing

-Temperature     :      80-120  °C
-Time            :      0,5 - 1 h

Notice text      :      Post treatment enables optimum dimensional 
                 :      stability.The treatment temperature is function
                 :      of the temperature towhich the part will experience.

                 :      ORGALLOY grades have low sensitivity to humidity.
                 :      Therefore it is not normally necessary to
                 :      precondition prior to assembly.
Other extrusion
PREPROCESSING
 

Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING
     

Melt temperature :      245-255 °C

Notice text      :      These products are well suited to the manufacture 
                 :      of blown films.Processable on a PE screw,
                 :      preferably 25D or greater. It is recommended to
                 :      avoid high levels of shearing action.

                 :      The ideal melt temperature is in the region of
                 :      250°C.For purging after use, it is suggested to
                 :      use HDPE MFI 0.5 or less.

                 :      In multilayer extrusion with PE : 200°C for the PE
                 :      screw and 230°C for Orgalloy.

Profile extrusion
PREPROCESSING


Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING
     

Melt temperature :      255-265 °C


Notice text      :      It is recommended to use an extruder equipped with 
                 :      a 25D or greater polyamide screw.It is also
                 :      recommended to avoid high levels of shearing action.

                 :      For extrusion of tubes, a calibration device should
                 :      be used which has a conical entry and good
                 :      regulation of cooling water flow.
Disclaimer

This database provides the main properties of technical thermoplastics
marketed by ARKEMA.

      The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.

For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991