View list of
Changing the Unit System?
FREE DOWNLOAD
Interested inChanging the Unit System?
The CAMPUS desktop version
offers extended functionality!CAMPUS® datasheet | ORGALLOY LT 5050 T6L
This datasheet of ORGALLOY LT 5050 T6L from ARKEMA is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
ORGALLOY LT 5050 T6L | PA6... | ARKEMA
Product Texts
ORGALLOY LT 5050 T6L - LT 5050ES NOIR Very flexible polyamide alloys: easy to process, low moisture absorption, good mechanical properties at low temperature. Demonstrate a good balance of properties eg, high flexibility (500 MPa), good thermal performance and and ductility at low temperatures. Suited to the extrusion of mandrels and for blow moulding of technical parts under the bonnet (air intake). LT 5050 T6L : standard grade. LT 5050ES NOIR : blow moulding of large parts.
| Rheological properties | dry / cond | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 2 / * | cm³/10min | ISO 1133 |
| Temperature | 235 / * | °C | ISO 1133 |
| Load | 5 / * | kg | ISO 1133 |
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | - / 460 | MPa | ISO 527-1/-2 |
| Stress at 50% strain | - / 23 | MPa | ISO 527-1/-2 |
| Strain at break | - / >50 | % | ISO 527-1/-2 |
| Tensile creep modulus (1h) | * / 420 | MPa | ISO 899-1 |
| Tensile creep modulus (1000h) | * / 270 | MPa | ISO 899-1 |
| Charpy impact strength (+23°C) | N / N | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | N / N | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 220 / * | °C | ISO 11357-1/-3 |
| Burning Behav. at 1.5 mm nom. thickn. | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 1.6 / * | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 3.2 / * | mm | IEC 60695-11-10 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Relative permittivity (100Hz) | - / 4 | - | IEC 60250 |
| Relative permittivity (1MHz) | - / 4 | - | IEC 60250 |
| Dissipation factor (100Hz) | - / 1100 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | - / 500 | E-4 | IEC 60250 |
| Volume resistivity | - / 7.50E11 | Ohm*m | IEC 60093 |
| Surface resistivity | * / >1E15 | Ohm | IEC 60093 |
| Electric strength | 36 / 36 | kV/mm | IEC 60243-1 |
| Comparative tracking index | * / 600 | - | IEC 60112 |
| Other properties | dry / cond | Unit | Test Standard |
| Density | 1040 / 1040 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 260 | °C | ISO 294 |
| Injection Molding, mold temperature | 60 | °C | ISO 10724 |
Diagrams
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Calandering, Transfer Molding, Thermoforming
Delivery form
Pellets
Special Characteristics
Platable, Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING
Max water content: 0,05-0,15 %
Notice text : ORGALLOY grades are delivered ready for use.
: If Orgalloy is not used within 4 hours of opening
: the bag,the product should be redried at 90°C
: during 4 hours.
PROCESSING
Melt temperature : 240-280 °C
Mold temperature : 20- 60 °C
Notice text : To avoid degradation, it is recommended to limit
: injection moulding temperature to 300°C.
: A higher mould temperature leads to higher shrinkage..
POSTPROCESSING
Annealing
-Temperature : 80-120 °C
-Time : 0,5 - 1 h
Notice text : Post treatment enables optimum dimensional
: stability.The treatment temperature is function
: of the temperature towhich the part will experience.
: ORGALLOY grades have low sensitivity to humidity.
: Therefore it is not normally necessary to
: precondition prior to assembly.
Profile extrusion
PREPROCESSING
Max water content: 0,05-0,15 %
Notice text : ORGALLOY grades are delivered ready for use.
: If Orgalloy is not used within 4 hours of opening
: the bag,the product should be redried at 90°C
: during 4 hours.
PROCESSING
Melt temperature : 255-265 °C
Notice text : It is recommended to use an extruder equipped with
: a 25D or greater polyamide screw.It is also
: recommended to avoid high levels of shearing action.
: For extrusion of tubes, a calibration device should
: be used which has a conical entry and good
: regulation of cooling water flow.
Blow molding
PREPROCESSING
Max water content: 0,05-0,15 %
Notice text : ORGALLOY grades are delivered ready for use.
: If Orgalloy is not used within 4 hours of opening
: the bag,the product should be redried at 90°C
: during 4 hours.
PROCESSING
Melt temperature : 245-255 °C
Notice text : These products are suited to all types of blow
: moulded components, including sequential 3D. It is
: necessary to select grades with comparable melt
: strength and swelling. Processable ona PE screw.
: The ideal melt temperature is around 250°C.
Chemical Media Resistance
Disclaimer
This database provides the main properties of technical thermoplastics
marketed by ARKEMA.
The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.
For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991













