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CAMPUS® datasheet | ORGALLOY LT 5050ES noir


This datasheet of ORGALLOY LT 5050ES noir from ARKEMA is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Test specimen production - Diagrams
  ORGALLOY LT 5050ES noir | PA6... | ARKEMA
Product Texts
ORGALLOY LT 5050ES NOIR - LT 5050 T6L 

Very flexible polyamide alloys: easy to process, low moisture 
absorption, good mechanical properties at low temperature. Demonstrate a 
good balance of properties eg, high flexibility (500 MPa), good thermal 
performance and and ductility at low temperatures.

Suited to blow moulding of technical parts under the bonnet (air intake).
Sequential extrusion with RS or LE series (rigid flexible combinations).

LT 5050 T6L   : standard grade.

LT 5050ES NOIR : blow moulding of large parts.
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Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 0.5 / * cm³/10min ISO 1133
Temperature 235 / * °C ISO 1133
Load 5 / * kg ISO 1133
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Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus - / 460 MPa ISO 527-1/-2
Stress at 50% strain - / 23 MPa ISO 527-1/-2
Strain at break - / >50 % ISO 527-1/-2
Tensile creep modulus (1h) * / 420 MPa ISO 899-1
Tensile creep modulus (1000h) * / 270 MPa ISO 899-1
Charpy impact strength (+23°C) N / N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) N / N kJ/m² ISO 179/1eA
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Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 220 / * °C ISO 11357-1/-3
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
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Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) - / 4 - IEC 60250
Relative permittivity (1MHz) - / 4 - IEC 60250
Dissipation factor (100Hz) - / 1100 E-4 IEC 60250
Dissipation factor (1MHz) - / 500 E-4 IEC 60250
Volume resistivity - / 7.50E11 Ohm*m IEC 60093
Surface resistivity * / >1E15 Ohm IEC 60093
Electric strength 36 / 36 kV/mm IEC 60243-1
Comparative tracking index * / 600 - IEC 60112
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Other propertiesdry / condUnitTest Standard
Density 1040 / 1040 kg/m³ ISO 1183
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 60 °C ISO 10724
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Diagrams
Stress-strain , ORGALLOY LT 5050ES noir, PA6..., ARKEMA
Secant modulus-strain , ORGALLOY LT 5050ES noir, PA6..., ARKEMA
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Characteristics
Processing
Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding, Calandering
Delivery form
Pellets
Special Characteristics
Platable, Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Profile extrusion
PREPROCESSING


Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING
     

Melt temperature :      255-265 °C


Notice text      :      It is recommended to use an extruder equipped with 
                 :      a 25D or greater polyamide screw.It is also
                 :      recommended to avoid high levels of shearing action.

                 :      For extrusion of tubes, a calibration device should
                 :      be used which has a conical entry and good
                 :      regulation of cooling water flow.
Blow molding
PREPROCESSING
 

Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING
     

Melt temperature :      245-255 °C

Notice text      :      These products are suited to all types of blow
                 :      moulded components, including sequential 3D. It is
                 :      necessary to select grades with comparable melt
                 :      strength and swelling. Processable ona PE screw.
                 :      The ideal melt temperature is around 250°C.
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Chemical Media Resistance
Acids
Sulfuric Acid (5% by mass) (23°C)
Bases
Sodium Hydroxide solution (1% by mass) (23°C)
Hydrocarbons
Toluene (23°C)
Ketones
Acetone (23°C)
Salt solutions
Zinc Chloride solution (50% by mass) (23°C)
Other
Ethylene Glycol (50% by mass) in water (108°C)
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Disclaimer

This database provides the main properties of technical thermoplastics
marketed by ARKEMA.

      The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.

For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM
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The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991