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CAMPUS® datasheet | ORGALLOY R 60ES


This datasheet of ORGALLOY R 60ES from ARKEMA is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Film Properties - Test specimen production - Diagrams
  ORGALLOY R 60ES | PA6... | ARKEMA
Product Texts
ORGALLOY R 60ES

Rigid polyamide 6 alloy: easy to process, low moisture absorption, 
chemical resistance (no known solvents).

Blow extrusion grade for technical films: thermal resistance, barrier to
gases and aromas, mechanical properties.

See LE series for other film grades.
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Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 2 / * cm³/10min ISO 1133
Temperature 235 / * °C ISO 1133
Load 2.16 / * kg ISO 1133
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Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus - / 2010 MPa ISO 527-1/-2
Yield stress - / 50 MPa ISO 527-1/-2
Yield strain - / 3.4 % ISO 527-1/-2
Nominal strain at break - / >50 % ISO 527-1/-2
Tensile creep modulus (1h) * / 2030 MPa ISO 899-1
Tensile creep modulus (1000h) * / 870 MPa ISO 899-1
Charpy notched impact strength (+23°C) 16 / 20 kJ/m² ISO 179/1eA
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Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 220 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 75 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 130 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 130 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
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Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) - / 3 - IEC 60250
Relative permittivity (1MHz) - / 3 - IEC 60250
Dissipation factor (100Hz) - / 620 E-4 IEC 60250
Dissipation factor (1MHz) - / 250 E-4 IEC 60250
Volume resistivity - / >1E13 Ohm*m IEC 60093
Surface resistivity * / >1E15 Ohm IEC 60093
Electric strength 38 / 38 kV/mm IEC 60243-1
Comparative tracking index * / 600 - IEC 60112
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Other propertiesdry / condUnitTest Standard
Water absorption 3.3 / * % Sim. to ISO 62
Humidity absorption 1.3 / * % Sim. to ISO 62
Density 1030 / 1030 kg/m³ ISO 1183
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Film Propertiesdry / condUnitTest Standard
Stress at yield (parallel) 35 / * MPa ISO 527-3
Stress at yield (normal) 33 / * MPa ISO 527-3
Strain at yield (parallel) 20 / * % ISO 527-3
Strain at yield (normal) 15 / * % ISO 527-3
Maximum stress (parallel) 80 / * MPa ISO 527-3
Maximum stress (normal) 60 / * MPa ISO 527-3
Maximum strain (parallel) 530 / * % ISO 527-3
Maximum strain (normal) 530 / * % ISO 527-3
Elmendorf Tear resistance (parallel) 40 / * N ISO 6383-2
Elmendorf Tear resistance (normal) 35 / * N ISO 6383-2
Oxygen transmission rate (23°C/0%r.h.) 170 / * cm³/(m²*d*bar) DIS 15105-1/-2
Oxygen transmission rate (23°C/85%r.h.) 170 / * cm³/(m²*d*bar) DIS 15105-1/-2
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 60 °C ISO 10724
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Diagrams
Viscosity-shear rate , ORGALLOY R 60ES, PA6..., ARKEMA
Shearstress-shear rate , ORGALLOY R 60ES, PA6..., ARKEMA
Dynamic Shear modulus-temperature , ORGALLOY R 60ES, PA6..., ARKEMA
Stress-strain , ORGALLOY R 60ES, PA6..., ARKEMA
Secant modulus-strain , ORGALLOY R 60ES, PA6..., ARKEMA
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Characteristics
Processing
Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding
Delivery form
Pellets
Special Characteristics
Platable, Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Other extrusion
PREPROCESSING
 

Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING

Melt temperature :      250-260 °C

Notice text      :      These products are well suited to the manufacture 
                 :      of blown films.Processable on a PE screw,
                 :      preferably 25D or greater. It is recommended to
                 :      avoid high levels of shearing action.

                 :      The ideal melt temperature is in the region of
                 :      250°C.For purging after use, it is suggested to
                 :      use HDPE MFI 0.5 or less.
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Chemical Media Resistance
Acids
Sulfuric Acid (5% by mass) (23°C)
Bases
Sodium Hydroxide solution (1% by mass) (23°C)
Alcohols
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
Toluene (23°C)
Ketones
Acetone (23°C)
Standard Fuels
Standard fuel with alcohol (pref. ISO 1817 Liquid 4) (23°C)
Salt solutions
Zinc Chloride solution (50% by mass) (23°C)
Other
Ethylene Glycol (50% by mass) in water (108°C)
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Disclaimer

This database provides the main properties of technical thermoplastics
marketed by ARKEMA.

      The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.

For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM
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The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991