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CAMPUS® datasheet | ORGALLOY RS 6630


This datasheet of ORGALLOY RS 6630 from ARKEMA is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Test specimen production - Diagrams
  ORGALLOY RS 6630 | PA66-GF30... | ARKEMA
Product Texts
ORGALLOY RS 6630 - RS 6620 - RS 6635A

RS 66 series, rigid polyamide 66 alloy: easy to process, chemical 
resistance  (no known solvents) and low moisture absorption leading to 
stability of mechanical, electrical and dimensional properties

The grades referenced: glass filled, for injection moulding and for 
extrusion of profiles.

RS 6620  : 20% glass fibre.

RS 6630  : 30% glass fibre.

RS 6635A : 35% glass fibre, with improved hydrolysis 
    and thermal resistance.
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Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 8 / * cm³/10min ISO 1133
Temperature 275 / * °C ISO 1133
Load 2.16 / * kg ISO 1133
Molding shrinkage (parallel) 0.3 / * % ISO 294-4, 2577
Molding shrinkage (normal) 0.8 / * % ISO 294-4, 2577
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Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus - / 8800 MPa ISO 527-1/-2
Stress at break - / 140 MPa ISO 527-1/-2
Strain at break - / 4 % ISO 527-1/-2
Tensile creep modulus (1h) * / 7900 MPa ISO 899-1
Tensile creep modulus (1000h) * / 5620 MPa ISO 899-1
Charpy notched impact strength (+23°C) 18 / 20 kJ/m² ISO 179/1eA
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Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 255 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 225 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 245 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 195 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
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Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) - / 3 - IEC 60250
Relative permittivity (1MHz) - / 4 - IEC 60250
Dissipation factor (100Hz) - / 290 E-4 IEC 60250
Dissipation factor (1MHz) - / 160 E-4 IEC 60250
Volume resistivity - / >1E13 Ohm*m IEC 60093
Surface resistivity * / >1E15 Ohm IEC 60093
Electric strength 34 / 34 kV/mm IEC 60243-1
Comparative tracking index * / 600 - IEC 60112
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Other propertiesdry / condUnitTest Standard
Water absorption 1.9 / * % Sim. to ISO 62
Humidity absorption 0.7 / * % Sim. to ISO 62
Density 1270 / 1270 kg/m³ ISO 1183
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 290 °C ISO 294
Injection Molding, mold temperature 60 °C ISO 10724
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Diagrams
Viscosity-shear rate , ORGALLOY RS 6630, PA66-GF30..., ARKEMA
Shearstress-shear rate , ORGALLOY RS 6630, PA66-GF30..., ARKEMA
Dynamic Shear modulus-temperature , ORGALLOY RS 6630, PA66-GF30..., ARKEMA
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Characteristics
Processing
Injection Molding, Profile Extrusion, Other Extrusion, Transfer Molding
Delivery form
Pellets
Special Characteristics
Platable, Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Injection molding
PREPROCESSING
 

Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING
     

Melt temperature :      260-290 °C
Mold temperature :       60- 80 °C

Notice text      :      To avoid degradation, it is recommended to limit
                 :      injection moulding temperature to 300°C.

                 :      A higher mould temperature leads to higher shrinkage..

POSTPROCESSING

Annealing

-Temperature     :      80-120  °C
-Time            :      0,5 - 1 h

Notice text      :      Post treatment enables optimum dimensional 
                 :      stability.The treatment temperature is function
                 :      of the temperature towhich the part will experience.

                 :      ORGALLOY grades have low sensitivity to humidity.
                 :      Therefore it is not normally necessary to
                 :      precondition prior to assembly.
Profile extrusion
PREPROCESSING


Max water content:      0,05-0,15       %

Notice text      :      ORGALLOY grades are delivered ready for use. 
   
                 :      If Orgalloy is not used within 4 hours of opening
                 :      the bag,the product should be redried at 90°C
                 :      during 4 hours.

PROCESSING
     

Melt temperature :      240-260 °C

Notice text      :      It is recommended to use an extruder equipped with
                 :      a 25D or greater polyamide screw.It is also
                 :      recommended to avoidhigh levels of shearing action.

                 :      Grades suited for extrusion of profiles
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Chemical Media Resistance
Acids
Sulfuric Acid (5% by mass) (23°C)
Bases
Sodium Hydroxide solution (1% by mass) (23°C)
Alcohols
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
Toluene (23°C)
Ketones
Acetone (23°C)
Standard Fuels
Standard fuel with alcohol (pref. ISO 1817 Liquid 4) (23°C)
Salt solutions
Zinc Chloride solution (50% by mass) (23°C)
Other
Ethylene Glycol (50% by mass) in water (108°C)
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Disclaimer

This database provides the main properties of technical thermoplastics
marketed by ARKEMA.

      The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.

For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM
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The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991