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offers extended functionality!CAMPUS® datasheet | P84 NT1
This datasheet of P84 NT1 from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
P84® NT1 | PI | Evonik Industries AG
Product Texts
Polyimid P84® NT - at a glance
- Excellent performance at high temperatures
- High strength and excellent shape stability
- Very good impact resistance
- High heat deflection temperature
- Very good creep resistance even at elevated temperatures
- Machinable with standard tools
- Low wear and friction behaviour
- Processing by Hot compression molding or Direct forming
Application examples
bushings, seals, bearings components, guides, gear wheels, and valve parts
in the automotive and aerospace industries and in industrial equipment.
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 3580 / - | MPa | ISO 527-1/-2 |
| Stress at break | 140 / - | MPa | ISO 527-1/-2 |
| Strain at break | 9.7 / - | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 40 / - | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 5.9 / - | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Glass transition temperature (10°C/min) | 337 / * | °C | ISO 11357-1/-2 |
| Temp. of deflection under load (1.80 MPa) | 319 / * | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 343 / * | °C | ISO 75-1/-2 |
| Coeff. of linear therm. expansion (parallel) | 41 / * | E-6/K | ISO 11359-1/-2 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Relative permittivity (100Hz) | 4.2 / - | - | IEC 60250 |
| Volume resistivity | >1E13 / - | Ohm*m | IEC 60093 |
| Surface resistivity | * / >1E15 | Ohm | IEC 60093 |
| Electric strength | 22 / - | kV/mm | IEC 60243-1 |
| Other properties | dry / cond | Unit | Test Standard |
| Density | 1380 / - | kg/m³ | ISO 1183 |
Characteristics
Delivery form
Granules, Powder
Additives
Lubricants
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Compression molding
Hot compression molding
Production of big semi-finished parts (plates, rods, tubes)
High pressure 400 kg/cm² and temperature above Tg (350-380 °C)
Cycle time = hours
Processing of precise parts by machining
Best mechanical properties
Direct forming
High number of small parts
Production of green parts at ambient temperature and very high pressure of 3 t/cm²
Cycle time = econds
Sub sequent sintering above Tg (350-380 °C)
No or little machining necessary
Disclaimer
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991











