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CAMPUS® datasheet | PEBAX 5533 SN 01


This datasheet of PEBAX 5533 SN 01 from ARKEMA is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:

  PEBAX 5533 SN 01 | TPA | ARKEMA
Product Texts
POLYETHER BLOCK AMIDE(PEBA)
PEBAX
hardness 55 shore D
Non plasticized flexible Polyamide
Outstanding mechanical properties at low temperature (-40°C)
Applications : overmolded parts for sport good 
        (Football shoe sole)
        Industrial (conveyor belts, transmission belts)
Rheological propertiesdry / condUnitTest Standard
Molding shrinkage (parallel) 1.0 / * % ISO 294-4, 2577
Molding shrinkage (normal) 1.2 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 165 / 161 MPa ISO 527-1/-2
Yield stress 12 / 12 MPa ISO 527-1/-2
Yield strain 25 / 25 % ISO 527-1/-2
Nominal strain at break >50 / >50 % ISO 527-1/-2
Stress at 10% elongation 10 / * MPa ISO 527-1/-2
Stress at 100% elongation 14 / * MPa ISO 527-1/-2
Stress at break TPE 52 / * MPa ISO 527-1/-2
Strain at break TPE >300 / * % ISO 527-1/-2
Charpy impact strength (+23°C) N / N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) N / N kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) N / N kJ/m² ISO 179/1eA
Compression Set under constant strain (23°C) 43 / * % ISO 815
Tear strength 106 / * kN/m ISO 34-1
Abrasion resistance 47 / * mm³ ISO 4649
Shore D hardness (15s) 50 / * - ISO 868
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 159 / * °C ISO 11357-1/-3
Temp. of deflection under load (0.45 MPa) 66 / * °C ISO 75-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
UL recognition UL / * - -
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 9 / - - IEC 60250
Relative permittivity (1MHz) 5 / - - IEC 60250
Dissipation factor (100Hz) 1110 / - E-4 IEC 60250
Dissipation factor (1MHz) 1020 / - E-4 IEC 60250
Volume resistivity 3.20E11 / - Ohm*m IEC 60093
Surface resistivity * / 3E12 Ohm IEC 60093
Electric strength 38.5 / - kV/mm IEC 60243-1
Comparative tracking index * / 600 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 1.2 / * % Sim. to ISO 62
Humidity absorption 0.6 / * % Sim. to ISO 62
Density 1010 / 1010 kg/m³ ISO 1183
Rheological calculation propertiesValueUnitTest Standard
Density of melt 830 kg/m³ -
Thermal conductivity of melt 0.18 W/(m K) -
Spec. heat capacity melt 2800 J/(kg K) -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 30 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 30 MPa ISO 294
Diagrams
Viscosity-shear rate , PEBAX 5533 SN 01, TPA, ARKEMA
Shearstress-shear rate , PEBAX 5533 SN 01, TPA, ARKEMA
Stress-strain , PEBAX 5533 SN 01, TPA, ARKEMA
Secant modulus-strain , PEBAX 5533 SN 01, TPA, ARKEMA
Stress-strain (isochronous) 23°C, PEBAX 5533 SN 01, TPA, ARKEMA
Creep modulus-time 23°C, PEBAX 5533 SN 01, TPA, ARKEMA
Stress-strain (isochronous) 40°C, PEBAX 5533 SN 01, TPA, ARKEMA
Creep modulus-time 40°C, PEBAX 5533 SN 01, TPA, ARKEMA
Stress-strain (isochronous) 60°C, PEBAX 5533 SN 01, TPA, ARKEMA
Creep modulus-time 60°C, PEBAX 5533 SN 01, TPA, ARKEMA
Stress-strain (isochronous) 80°C, PEBAX 5533 SN 01, TPA, ARKEMA
Creep modulus-time 80°C, PEBAX 5533 SN 01, TPA, ARKEMA
Specific volume-temperature (pvT) , PEBAX 5533 SN 01, TPA, ARKEMA
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Other Extrusion, Transfer Molding, Casting, Thermoforming
Delivery form
Pellets
Special Characteristics
Platable, Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING
 

Max water content:      0.03 - 0.15     %

Notice text      :      Our products are delivered pre-dried and in sealed
                 :      bags.Therefore, they do not require any drying
                 :      stage before use:

                 :      1- Keep the bags at the workshop temperature for
                 :         several hours before use.

                 :      2- Re-dry the product whenever the bags have
                 :         remained open for more than 4 hours.

PROCESSING
     

Melt temperature :      200 - 260       °C
Mold temperature :       20 -  40       °C

Notice text      :      Under specific conditions, our product can easily 
                 :      withstand 20 to 30 degrees more than the
                 :      recommended temperatures.

Film extrusion
PREPROCESSING
 

Max water content:      0.03 - 0.15     %

Notice text      :      Our products are delivered pre-dried and in sealed
                 :      bags.Therefore, they do not require any drying
                 :      stage before use:

                 :      1- Keep the bags at the workshop temperature for
                 :         several hours before use.

                 :      2- Re-dry the product whenever the bags have
                 :         remained open for more than 4 hours.

PROCESSING
     

Melt temperature :      210 - 230       °C

Other extrusion
PREPROCESSING
 

Max water content:      0.03 - 0.15     %

Notice text      :      Our products are delivered pre-dried and in sealed
                 :      bags.Therefore, they do not require any drying
                 :      stage before use:

                 :      1- Keep the bags at the workshop temperature for
                 :         several hours before use.

                 :      2- Re-dry the product whenever the bags have
                 :         remained open for more than 4 hours.

PROCESSING
     

Melt temperature :      200 - 240       °C
Profile extrusion
PREPROCESSING
 

Max water content:      0.03 - 0.15     %

Notice text      :      Our products are delivered pre-dried and in sealed
                 :      bags.Therefore, they do not require any drying
                 :      stage before use:

                 :      1- Keep the bags at the workshop temperature for
                 :         several hours before use.

                 :      2- Re-dry the product whenever the bags have
                 :         remained open for more than 4 hours.

PROCESSING
     

Melt temperature :      170 - 210       °C

Notice text      :      Too high temperatures can generate sticking of the
                 :      melt on the sizer.

Sheet extrusion
PREPROCESSING
 

Max water content:      0.03 - 0.15     %

Notice text      :      Our products are delivered pre-dried and in sealed
                 :      bags.Therefore, they do not require any drying
                 :      stage before use:

                 :      1- Keep the bags at the workshop temperature for
                 :         several hours before use.

                 :      2- Re-dry the product whenever the bags have
                 :         remained open for more than 4 hours.

PROCESSING
     

Melt temperature :      210 - 230       °C
Disclaimer

This database provides the main properties of technical thermoplastics
marketed by ARKEMA.

      The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.

For information about the other products marketed
by our company consult :
ARKEMAGROUP.COM

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991