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CAMPUS® datasheet | RADILON® S USZ200


This datasheet of RADILON® S USZ200 from RadiciPlastics is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  RADILON® S USZ200 | PA6-I | RadiciPlastics
Product Texts
DESIGNATION:
Thermoplastics ISO1874-PA6-HI,MR,-020

BRIEF DESCRIPTION:
PA6 Injection moulding grade.
High impact strength at low temperatures.
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 1650 / 600 MPa ISO 527-1/-2
Yield stress 35 / 20 MPa ISO 527-1/-2
Yield strain 3.5 / 30 % ISO 527-1/-2
Nominal strain at break >50 / >50 % ISO 527-1/-2
Charpy impact strength (+23°C) N / N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 90 / 125 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 90 / 36 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 220 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 50 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 135 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 150 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 0.8 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Volume resistivity >1E13 / 1E13 Ohm*m IEC 60093
Surface resistivity * / 1E14 Ohm IEC 60093
Comparative tracking index * / 600 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 7.9 / * % Sim. to ISO 62
Humidity absorption 2 / * % Sim. to ISO 62
Density 1060 / * kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Processing conditions acc. ISO 1874 - ISO ....-2
Injection Molding, melt temperature 260 °C ISO 294
Injection Molding, mold temperature 40 °C ISO 10724
Diagrams
Viscosity-shear rate , RADILON® S USZ200, PA6-I, RadiciPlastics
Shearstress-shear rate , RADILON® S USZ200, PA6-I, RadiciPlastics
Stress-strain , RADILON® S USZ200, PA6-I, RadiciPlastics
Stress-strain , RADILON® S USZ200, PA6-I, RadiciPlastics
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Lubricants
Regional Availability
Other text information
Injection molding
PREPROCESSING
Max. water content 0.2%
Drying temperature 80°C
Drying time 2-4h (dry air dryer)

PROCESSING
Melt temperature 260°C
Mold temperature 40°C
Disclaimer
This database provides the technical properties
of thermoplastics produced and marketed by
RADICI NOVACIPS
and his subsidiaries companies:

RADILON® A          Polyamide 66
RADILON® S          Polyamide 6
RADILON® CA       Copolyamide 66/6
RADILON® CS       Copolyamide 6 semiaromatic
RADITER® B          Poly(butylene terephthalate)
RADIFLAM® A         Polyamide 66,  self-extinguishing
RADIFLAM® S         Polyamide 6,   self-extinguishing
RADIFLAM® B         Polybutylene terephthalate, self-extinguishing
HERAFLEX® A        Stirenic Thermoplastic Elastomer SEBS
HERAFLEX® E        Ether-Ester Thermoplastic Elastomer
HERAFLEX® B        Stirenic Thermoplastic Elastomer SBS
HERAFLEX® P        Modified Polypropylene
RADILENE® R        Polyethylene and Polypropylene

The data and graphs contained in this database were carried out
by our Research Centers and shall in no event be held to
constitute or imply any warranty, undertaking, express or
implied commitment from our part.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991