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CAMPUS® datasheet | Rilsan® BESN O TL
This datasheet of Rilsan® BESN O TL from ARKEMA is provided by the international plastics database CAMPUS.
Rilsan® BESN O TL | PA11 | ARKEMA
Product Texts
DESIGNATION ISO 1874-PA11,EHL,22-010
Rilsan® BESNO TL is a polyamide produced from a renewable source.
This natural grade is designed for extrusion.
| Rheological properties | dry / cond | Unit | Test Standard |
| Melt volume-flow rate, MVR | 1 / * | cm³/10min | ISO 1133 |
| Temperature | 235 / * | °C | ISO 1133 |
| Load | 2.16 / * | kg | ISO 1133 |
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 1450 / 1280 | MPa | ISO 527-1/-2 |
| Yield stress | 42 / 39 | MPa | ISO 527-1/-2 |
| Yield strain | 5 / 5 | % | ISO 527-1/-2 |
| Nominal strain at break | >50 / >50 | % | ISO 527-1/-2 |
| Charpy impact strength, +23°C | - / N | kJ/m² | ISO 179/1eU |
| Charpy impact strength, -30°C | - / N | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength, +23°C | - / 11 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength, -30°C | - / 12 | kJ/m² | ISO 179/1eA |
| Puncture - maximum force, -30°C | - / 6000 | N | ISO 6603-2 |
| Puncture energy, -30°C | - / 70 | J | ISO 6603-2 |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature, 10°C/min | 186 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load, 1.80 MPa | 50 / * | °C | ISO 75-1/-2 |
| Temp. of deflection under load, 0.45 MPa | 145 / * | °C | ISO 75-1/-2 |
| Vicat softening temperature, 50°C/h 50N | 160 / * | °C | ISO 306 |
| Coeff. of linear therm. expansion, parallel | 85 / * | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | V-2 / * | class | IEC 60695-11-10 |
| Thickness tested | 1.6 / * | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | V-2 / * | class | IEC 60695-11-10 |
| Thickness tested | 3.2 / * | mm | IEC 60695-11-10 |
| Oxygen index | 25 / * | % | ISO 4589-1/-2 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Relative permittivity, 100Hz | 3 / - | - | IEC 60250 |
| Relative permittivity, 1MHz | 3 / - | - | IEC 60250 |
| Dissipation factor, 100Hz | 308 / - | E-4 | IEC 60250 |
| Dissipation factor, 1MHz | 183 / - | E-4 | IEC 60250 |
| Volume resistivity | - / 1E12 | Ohm*m | IEC 60093 |
| Surface resistivity | * / 1E14 | Ohm | IEC 60093 |
| Electric strength | - / 30 | kV/mm | IEC 60243-1 |
| Other properties | dry / cond | Unit | Test Standard |
| Water absorption | 1.9 / * | % | Sim. to ISO 62 |
| Density | 1020 / 1020 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 260 | °C | ISO 294 |
| Injection Molding, mold temperature | 50 | °C | ISO 10724 |
| Injection Molding, pressure at hold | 16 | MPa | ISO 294 |
Diagrams
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion
Delivery form
Pellets
Additives
Lubricants
Special Characteristics
Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Regional Availability
Chemical Media Resistance
Disclaimer
This database provides the main properties of technical thermoplastics
marketed by ARKEMA.
The information contained in this document is based on trials carried
out by our Research Centres and data selected from the literature, but
shall in no event be held to constitute or imply any warranty,
undertaking, express or implied commitment from our part.
Our format specifications define the limit of our commitment.
No liability whatsoever can be accepted by ARKEMA with regard to the
handling processing or use of the product or products concerned which
much in all cases be employed in accordance with all relevant laws
and/or regulations in force in the country or countries concerned.
For information about the other products marketed
by our company consult :
ARKEMA,
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012