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CAMPUS® datasheet | Styrolux® 693 D


This datasheet of Styrolux® 693 D from Styrolution Group GmbH is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Test specimen production
  Styrolux® 693 D | SB | Styrolution Group GmbH
Product Texts
Styrolux® 693 D is a clear styrene-butadiene copolymer (SBC) with a well balanced combination of toughness and clarity. Styrolux® 693 D is mainly used for thermoformed articles, especially in blends with general-purpose polystyrene. Styrolux® 693 D contains a microcrystalline wax which acts as an antiblock providing processing benefits but decreases the printability.

Major applications include: food and non-food packagings, thermoformed transparent containers and cups for cold beverages, thermoformed lids, toys, boxes.
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Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 12.5 cm³/10min ISO 1133
Temperature 200 °C ISO 1133
Load 5 kg ISO 1133
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 1300 MPa ISO 527-1/-2
Yield stress 22 MPa ISO 527-1/-2
Yield strain 2.2 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Tensile creep modulus, 1000h 490 MPa ISO 899-1
Charpy impact strength, +23°C N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 5 kJ/m² ISO 179/1eA
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Thermal propertiesValueUnitTest Standard
Temp. of deflection under load, 1.80 MPa 59 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 72 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 48 °C ISO 306
Coeff. of linear therm. expansion, parallel 75 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.2 mm IEC 60695-11-10
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Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 2.5 - IEC 60250
Relative permittivity, 1MHz 2.5 - IEC 60250
Dissipation factor, 100Hz 3 E-4 IEC 60250
Dissipation factor, 1MHz 8 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity 1E15 Ohm IEC 60093
Comparative tracking index 600 - IEC 60112
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Other propertiesValueUnitTest Standard
Water absorption 0.07 % Sim. to ISO 62
Humidity absorption 0.07 % Sim. to ISO 62
Density 1010 kg/m³ ISO 1183
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 230 °C ISO 294
Injection Molding, mold temperature 50 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
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Characteristics
Processing
Injection Molding, Film Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding
Regional Availability
North America, Europe, Asia Pacific, South and Central America
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Other text information
Injection molding
PROCESSING
injection molding, Melt temperature, range: 180 - 250 °C
injection molding, Mold temperature, range: 20 - 40 °C
Film extrusion
PROCESSING
Extrusion, Blown film, Melt temperature: 180 °C
Extrusion, Flat film, Melt temperature: 190 - 230 °C
Other extrusion
PROCESSING
Extrusion, Pipes, Melt temperature: 230 °C
Sheet extrusion
PROCESSING
Extrusion, Plates, Melt temperature: 190 °C
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Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact

Styrolution GmbH
Styrolution Infopoint
mailto:styrenics.infopoint@basf.com
Tel: +49 621 60 41446

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
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CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012