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offers extended functionality!CAMPUS® datasheet | TROGAMID BX9724 blk (sw)
This datasheet of TROGAMID BX9724 blk (sw) from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
High stiffness, low warpage and high heat deflection temperature resin,
glass fiber reinforced (40%), thermoplastic Polyamide; dimensionally
stable also with water absorption, exceptionally high stiffness and strength,
at the same time as good impact and knocked impact resistance. Suitable
for the substitution of metal molded parts with plastic parts.
| Rheological properties | Value | Unit | Test Standard |
| Molding shrinkage (parallel) | 0.1 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 0.7 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 11000 | MPa | ISO 527-1/-2 |
| Stress at break | 220 | MPa | ISO 527-1/-2 |
| Strain at break | 3 | % | ISO 527-1/-2 |
| Tensile creep modulus (1h) | 9600 | MPa | ISO 899-1 |
| Tensile creep modulus (1000h) | 5200 | MPa | ISO 899-1 |
| Charpy impact strength (+23°C) | 95 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 80 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 14 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 10 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 260 | °C | ISO 11357-1/-3 |
| Glass transition temperature (10°C/min) | 93 | °C | ISO 11357-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 230 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 230 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 22 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 38 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 0.8 | mm | IEC 60695-11-10 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (1MHz) | 6.2 | - | IEC 60250 |
| Dissipation factor (1MHz) | 250 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | 1E13 | Ohm | IEC 60093 |
| Electric strength | 27 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 600 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 2.9 | % | Sim. to ISO 62 |
| Density | 1480 | kg/m³ | ISO 1183 |
| Material specific properties | Value | Unit | Test Standard |
| Viscosity number | 130 | cm³/g | ISO 307, 1157, 1628 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 300 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 70 | MPa | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is
dependent on the drying temperature. In practice a drying time of 6-12 hours at a temperature
of 100 - 120°C (depending on the water content of the resin) has been found to be satisfactory.
With the exception of fresh air dryers, all conventional dryers can be used.
PROCESSING IN FORMATION
| Melt Temperature: | 280 - 320 | °C |
| Mold Temperature: | 80 - 120 | °C |
POSTPROCESSING INFORMATION
Conditioning of parts from this grade is only recommended in exceptional cases. Due to con-
ditioning in water at 23°C the stiffness may decrease while the toughness may increase slightly.
In the case of application problems please contact the application technology depa rtment of the
High Performance Polymers Business Unit at EVONIK Industries.
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991