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CAMPUS® datasheet | TROGAMID CX9704


This datasheet of TROGAMID CX9704 from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  TROGAMID® CX9704 | PAIND/INDT | Evonik Industries AG
Product Texts
TROGAMID® CX9704

 

Resin: ISO1874 PA PACM-MGT, 14-010

 

Permanetly transparent resin with low water absorption, dimensionally stable.

 

Applications:

  • electronical components
  • components for laboratory applications
  • components for automotive industry
  • parts for cosmetics packaging
  • parts for optical industry
  • medical applications
Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 30 / * cm³/10min ISO 1133
Temperature 275 / * °C ISO 1133
Load 5 / * kg ISO 1133
Molding shrinkage (parallel) 0.4 / * % ISO 294-4, 2577
Molding shrinkage (normal) 0.5 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 1400 / - MPa ISO 527-1/-2
Yield stress 60 / - MPa ISO 527-1/-2
Yield strain 8 / - % ISO 527-1/-2
Nominal strain at break >50 / - % ISO 527-1/-2
Charpy impact strength (+23°C) N / - kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / - kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 11 / - kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 10 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 250 / * °C ISO 11357-1/-3
Glass transition temperature (10°C/min) 130 / * °C ISO 11357-1/-2
Temp. of deflection under load (1.80 MPa) 102 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 120 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 125 / * °C ISO 306
Coeff. of linear therm. expansion (parallel) 90 / * E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 90 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 0.8 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 3.4 / - - IEC 60250
Relative permittivity (1MHz) 3.3 / - - IEC 60250
Dissipation factor (100Hz) 130 / - E-4 IEC 60250
Dissipation factor (1MHz) 215 / - E-4 IEC 60250
Volume resistivity 1E13 / - Ohm*m IEC 60093
Comparative tracking index 600 / - - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 3.5 / * % Sim. to ISO 62
Humidity absorption 1.5 / * % Sim. to ISO 62
Density 1020 / - kg/m³ ISO 1183
Material specific propertiesdry / condUnitTest Standard
Viscosity number 130 / * cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Density of melt 900 kg/m³ -
Thermal conductivity of melt 0.25 W/(m K) -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 280 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion
Delivery form
Granules
Special Characteristics
Transparent
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the water content is exceeded, the resin must be dried.
The drying times is dependent on the drying temperature. In practice a drying time

of 8-16 hours at a temperature of 100 - 120°C (depending on the water content of

the resin) has been found to be satisfactory. With the exception of fresh air dryers,

all conventional dryers can be used.

PROCESSING INFORMATION

Melt Temperature: 260 - 300 °C

Mold Temperature: 60 - 100 °C
Film extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the water content is exceeded, the resin must be dried.
The drying times is dependent on the drying temperature. In practice a drying time

of 8-16 hours at a temperature of 100 - 120°C (depending on the water content of

the resin) has been found to be satisfactory. With the exception of fresh air dryers,

all conventional dryers can be used.

PROCESSING INFORMATION

Melt Temperature: 260 - 300 °C

Mold Temperature: 60 - 100 °C
Profile extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the water content is exceeded, the resin must be dried.
The drying times is dependent on the drying temperature. In practice a drying time

of 8-16 hours at a temperature of 100 - 120°C (depending on the water content of

the resin) has been found to be satisfactory. With the exception of fresh air dryers,

all conventional dryers can be used.

PROCESSING INFORMATION

Melt Temperature: 260 - 300 °C

Mold Temperature: 60 - 100 °C
Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991