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CAMPUS® datasheet | TROGAMID T-GF35 nc (nf)


This datasheet of TROGAMID T-GF35 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  TROGAMID® T-GF35 nc (nf) | PAIND/INDT-GF35 | Evonik Industries AG
Product Texts
TROGAMID® T-GF35 nc

 

Resin:                          ISO 1874, (PA NDT/INDT), DIN 16773 (PA 6-3-T)

Previous designation: TROGAMID® T G5106 nf

 

Glass fibre reinforced PA-6-3-T resin for the injection moulding of rigid,

low-warpage parts. Components with high mechanical strengths, machine elements.

Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 9 cm³/10min ISO 1133
Temperature 300 °C ISO 1133
Load 5 kg ISO 1133
Molding shrinkage (parallel) 0 % ISO 294-4, 2577
Molding shrinkage (normal) 0.4 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 10000 MPa ISO 527-1/-2
Stress at break 140 MPa ISO 527-1/-2
Strain at break 2.1 % ISO 527-1/-2
Tensile creep modulus (1h) 10000 MPa ISO 899-1
Tensile creep modulus (1000h) 8300 MPa ISO 899-1
Charpy impact strength (+23°C) 77 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 60 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 9 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 7 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Glass transition temperature (10°C/min) 150 °C ISO 11357-1/-2
Temp. of deflection under load (1.80 MPa) 140 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 150 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 150 °C ISO 306
Coeff. of linear therm. expansion (parallel) 30 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 30 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 5 - IEC 60250
Relative permittivity (1MHz) 3.8 - IEC 60250
Dissipation factor (100Hz) 180 E-4 IEC 60250
Dissipation factor (1MHz) 240 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity >1E15 Ohm IEC 60093
Electric strength 35 kV/mm IEC 60243-1
Comparative tracking index 575 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 5 % Sim. to ISO 62
Density 1400 kg/m³ ISO 1183
Material specific propertiesValueUnitTest Standard
Viscosity number 100 cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1290 kg/m³ -
Thermal conductivity of melt 0.25 W/(m K) -
Spec. heat capacity melt 1820 J/(kg K) -
Ejection temperature 130 °C -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 300 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Diagrams
Dynamic Shear modulus-temperature , TROGAMID® T-GF35 nc (nf), PAIND/INDT-GF35, Evonik Degussa
Stress-strain (isochronous) 23°C, TROGAMID® T-GF35 nc (nf), PAIND/INDT-GF35, Evonik Degussa
Creep modulus-time 23°C, TROGAMID® T-GF35 nc (nf), PAIND/INDT-GF35, Evonik Degussa
Spec. enthalpy/mass-temp. (DSC) , TROGAMID® T-GF35 nc (nf), PAIND/INDT-GF35, Evonik Degussa
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Regional Availability
Other text information
Injection molding


PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. In practice a drying time of 6-12 hours at a temperature of 100 - 120°C

(depending on the water content of the resin) has been found to be satisfactory.
With the exception of fresh air dryers, all conventional dryers can be used.

PROCESSING INFORMATION

Melt Temperature:280 - 300°C
Mold Temperature:50 - 100°C
Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991