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CAMPUS® datasheet | TROGAMID TX7389 nc (nf)


This datasheet of TROGAMID TX7389 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Material specific properties - Rheological calculation properties - Test specimen production - Diagrams
  TROGAMID® TX7389 nc (nf) | PAIND/INDT | Evonik Industries AG
Product Texts
TROGAMID® TX7389 nc


Permanently transparent product of PA6-3-T with significantly improved flow

and mold removal properties; especially for use in parts with high flow path

to wall thickness ratios.
 

Application example: Electrical industry, machinery construction
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Rheological propertiesValueUnitTest Standard
Molding shrinkage (parallel) 0.5 % ISO 294-4, 2577
Molding shrinkage (normal) 0.6 % ISO 294-4, 2577
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2700 MPa ISO 527-1/-2
Yield stress 88 MPa ISO 527-1/-2
Yield strain 8 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Tensile creep modulus (1h) 2200 MPa ISO 899-1
Tensile creep modulus (1000h) 1600 MPa ISO 899-1
Charpy impact strength (+23°C) N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 10 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 6 kJ/m² ISO 179/1eA
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Thermal propertiesValueUnitTest Standard
Glass transition temperature (10°C/min) 149 °C ISO 11357-1/-2
Temp. of deflection under load (1.80 MPa) 120 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 140 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 140 °C ISO 306
Coeff. of linear therm. expansion (parallel) 60 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 60 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. V-2 class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h V-2 class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
UL recognition UL - -
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Electrical propertiesValueUnitTest Standard
Relative permittivity (1MHz) 3.8 - IEC 60250
Dissipation factor (1MHz) 280 E-4 IEC 60250
Volume resistivity >1E13 Ohm*m IEC 60093
Surface resistivity >1E15 Ohm IEC 60093
Electric strength 23 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
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Other propertiesValueUnitTest Standard
Water absorption 7.5 % Sim. to ISO 62
Density 1120 kg/m³ ISO 1183
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Material specific propertiesValueUnitTest Standard
Viscosity number 115 cm³/g ISO 307, 1157, 1628
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Rheological calculation propertiesValueUnitTest Standard
Density of melt 950 kg/m³ -
Thermal conductivity of melt 0.22 W/(m K) -
Spec. heat capacity melt 2370 J/(kg K) -
Ejection temperature 125 °C -
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 300 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
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Diagrams
Stress-strain (isochronous) 23°C, TROGAMID® TX7389 nc (nf), PAIND/INDT, Evonik Degussa
Creep modulus-time 23°C, TROGAMID® TX7389 nc (nf), PAIND/INDT, Evonik Degussa
Spec. enthalpy/mass-temp. (DSC) , TROGAMID® TX7389 nc (nf), PAIND/INDT, Evonik Degussa
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Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Lubricants, Release agent
Special Characteristics
Transparent
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. In practice a drying time of 6-12 hours at a temperature of 100 - 120°C

(depending on the water content of the resin) has been found to be satisfactory.
With the exception of fresh air dryers, all conventional dryers can be used.

PROCESSING INFORMATION

Melt Temperature:260 - 300°C
Mold Temperature:50 - 100°C
POSTPROCESSING INFORMATION
Tempering:
Temperature:120 °C
Tempering Time:4 h
The level of internal strain in injection molded products can be reduced through tempering.
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Chemical Media Resistance
Acids
Acetic Acid (5% by mass) (23°C)
Hydrochloric Acid (36% by mass) (23°C)
Nitric Acid (40% by mass) (23°C)
Sulfuric Acid (38% by mass) (23°C)
Sulfuric Acid (5% by mass) (23°C)
Bases
Sodium Hydroxide solution (35% by mass) (23°C)
Sodium Hydroxide solution (1% by mass) (23°C)
Alcohols
Isopropyl alcohol (23°C)
Ethanol (23°C)
Hydrocarbons
n-Hexane (23°C)
Toluene (23°C)
iso-Octane (23°C)
Ketones
Acetone (23°C)
Ethers
Diethyl ether (23°C)
Standard Fuels
Standard fuel without alcohol (pref. ISO 1817 Liquid C) (23°C)
Other
Ethyl Acetate (23°C)
Ethylene Glycol (50% by mass) in water (108°C)
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Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!
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The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991