View list of
VDA CAMPUS Datasheet?
FREE DOWNLOAD
Interested inVDA CAMPUS Datasheet?
The CAMPUS desktop version
offers extended functionality!CAMPUS® datasheet | Technyl® A 218 V50
This datasheet of Technyl® A 218 V50 from Rhodia Polyamide Engineering Plastics is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Technyl® A 218 V50 | PA66-GF50 | Rhodia Polyamide Engineering Plastics
Product Texts
Polyamide 66, reinforced with 50% of glass fibre, heat stabilized, for injection moulding
TECHNYL A 218 V50 is used in all sectors of industry, offering an excellent combination between thermal and mechanical properties. This grade is commonly used in the electrical industry, i.e. bobbin coil former, and in the automotive industry for engine components.
TECHNYL A 218 V50 is used in all sectors of industry, offering an excellent combination between thermal and mechanical properties. This grade is commonly used in the electrical industry, i.e. bobbin coil former, and in the automotive industry for engine components.
This product is available in natural and black.
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 16200 / 12500 | MPa | ISO 527-1/-2 |
| Stress at break | 240 / 175 | MPa | ISO 527-1/-2 |
| Strain at break | 2 / 2.5 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 95 / 97 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 16 / 18 | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 263 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 256 / * | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 258 / * | °C | ISO 75-1/-2 |
| Coeff. of linear therm. expansion (parallel) | 15 / * | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at thickness h | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 1.6 / * | mm | IEC 60695-11-10 |
| Oxygen index | 23 / * | % | ISO 4589-1/-2 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Relative permittivity (100Hz) | 4 / 9 | - | IEC 60250 |
| Relative permittivity (1MHz) | 3.7 / 4 | - | IEC 60250 |
| Dissipation factor (100Hz) | 100 / 1500 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | 100 / 1100 | E-4 | IEC 60250 |
| Volume resistivity | 1E13 / 1E11 | Ohm*m | IEC 60093 |
| Surface resistivity | * / 1E12 | Ohm | IEC 60093 |
| Electric strength | 35 / 30 | kV/mm | IEC 60243-1 |
| Comparative tracking index | 500 / 600 | - | IEC 60112 |
| Other properties | dry / cond | Unit | Test Standard |
| Water absorption | 0.6 / * | % | Sim. to ISO 62 |
| Density | 1570 / - | kg/m³ | ISO 1183 |
| Material specific properties | dry / cond | Unit | Test Standard |
| Viscosity number | 135 / * | cm³/g | ISO 307, 1157, 1628 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 220 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
Diagrams
Characteristics
Processing
Injection Molding
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
Recommended moulding conditions:
Barrel temperatures: - feed zone 260 - 270°C
- compression zone 270 - 280°C
- front zone 280 - 290°C
Mould temperatures: 60 at 100°C
Chemical Media Resistance
Disclaimer
WARRANTY This information is supplied to assist you in your choice of the material best suited to your requirements and does not in any way constitute a product specification. The values given relate to unpigmented materials (natural colour). Pigmentation can alter results. The characteristics supplied are typical values. Our specialists are available to advise you on the values to be used in order to carry out calculations correctly on part dimensions. The information contained in this document is supplied in good faith. However it is given purely as an indication. It shall not be considered in any way as a formal commitment or warranty on our part, notably in respect of the eventual infringement of any rights of third parties who may use our products. We remain at your entire disposal to provide you with any information that you might require.
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991













