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CAMPUS® datasheet | Technyl® C 246M


This datasheet of Technyl® C 246M from Rhodia Polyamide Engineering Plastics is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

This datasheet includes:

  Technyl® C 246M | PA6 | Rhodia Polyamide Engineering Plastics
Product Texts
Polyamide 6, unreinforced, with high impact resistance for injection moulding
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 2000 / 1100 MPa ISO 527-1/-2
Charpy notched impact strength (+23°C) 55 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 222 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 60 / * °C ISO 75-1/-2
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (1MHz) 3.5 / 4 - IEC 60250
Dissipation factor (1MHz) 200 / - E-4 IEC 60250
Volume resistivity >1E13 / 1E11 Ohm*m IEC 60093
Surface resistivity * / 1E11 Ohm IEC 60093
Electric strength - / 18 kV/mm IEC 60243-1
Other propertiesdry / condUnitTest Standard
Density 1080 / - kg/m³ ISO 1183
Diagrams
Stress-strain , Technyl® C 246M, PA6, Rhodia
Characteristics
Processing
Injection Molding
Regional Availability
Other text information
Injection molding
PROCESSING
Melt temperature: 220°C
Mold temperature: 50°C
Disclaimer
WARRANTY

 This information is supplied to assist you in your choice of the
 material best suited to your requirements and does not in any way
 constitute a product specification.

 The values given relate to unpigmented materials (natural colour).
 Pigmentation can alter results. The characteristics supplied are
 typical values. Our specialists are available to advise you on the
 values to be used in order to carry out calculations correctly on
 part dimensions.

 The information contained in this document is supplied in good
 faith. However it is given purely as an indication. It shall not be
 considered in any way as a formal commitment or warranty on our part,
 notably in respect of the eventual infringement of any rights of
 third parties who may use our products. We remain at your entire
 disposal to provide you with any information that you might require.


The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991