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offers extended functionality!CAMPUS® datasheet | Technyl® C 502XT
This datasheet of Technyl® C 502XT from Rhodia Polyamide Engineering Plastics is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
Technyl® C 502XT | PA6 | Rhodia Polyamide Engineering Plastics
Product Texts
Unreinforced polyamide 6, very high viscosity, for extrusion.
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 2800 / 900 | MPa | ISO 527-1/-2 |
| Yield stress | 80 / - | MPa | ISO 527-1/-2 |
| Yield strain | 4.1 / - | % | ISO 527-1/-2 |
| Nominal strain at break | >50 / - | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | N / - | kJ/m² | ISO 179/1eU |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 222 / * | °C | ISO 11357-1/-3 |
| Other properties | dry / cond | Unit | Test Standard |
| Humidity absorption | 1.37 / * | % | Sim. to ISO 62 |
| Density | 1130 / - | kg/m³ | ISO 1183 |
Diagrams
Characteristics
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Chemical Media Resistance
Disclaimer
WARRANTY This information is supplied to assist you in your choice of the material best suited to your requirements and does not in any way constitute a product specification. The values given relate to unpigmented materials (natural colour). Pigmentation can alter results. The characteristics supplied are typical values. Our specialists are available to advise you on the values to be used in order to carry out calculations correctly on part dimensions. The information contained in this document is supplied in good faith. However it is given purely as an indication. It shall not be considered in any way as a formal commitment or warranty on our part, notably in respect of the eventual infringement of any rights of third parties who may use our products. We remain at your entire disposal to provide you with any information that you might require.
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991