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CAMPUS® datasheet | Terblend® N NM-12 UV
This datasheet of Terblend® N NM-12 UV from Styrolution Group GmbH is provided by the international plastics database CAMPUS.
You may contact the supplier for more information about this grade.
Terblend® N NM-12 UV | (ABS+PA6) | Styrolution Group GmbH
Product Texts
Terblend® N NM-12 is an UV stabilised ABS/PA blend combining high impact strength and rigidity with a excellent processability and surface appearance.
| Rheological properties | dry / cond | Unit | Test Standard |
| Melt volume-flow rate, MVR | 34 / * | cm³/10min | ISO 1133 |
| Temperature | 240 / * | °C | ISO 1133 |
| Load | 10 / * | kg | ISO 1133 |
| Molding shrinkage, parallel | 0.7 / * | % | ISO 294-4, 2577 |
| Molding shrinkage, normal | 0.8 / * | % | ISO 294-4, 2577 |
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 2200 / 1600 | MPa | ISO 527-1/-2 |
| Yield stress | 50 / 45 | MPa | ISO 527-1/-2 |
| Yield strain | 3.2 / 5 | % | ISO 527-1/-2 |
| Nominal strain at break | 20 / >50 | % | ISO 527-1/-2 |
| Charpy impact strength, +23°C | N / - | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength, +23°C | 17 / - | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength, -30°C | 9 / - | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Temp. of deflection under load, 1.80 MPa | 66 / * | °C | ISO 75-1/-2 |
| Temp. of deflection under load, 0.45 MPa | 88 / * | °C | ISO 75-1/-2 |
| Vicat softening temperature, 50°C/h 50N | 105 / * | °C | ISO 306 |
| Coeff. of linear therm. expansion, parallel | 90 / * | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 1.6 / * | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 3.2 / * | mm | IEC 60695-11-10 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Relative permittivity, 100Hz | 3.3 / - | - | IEC 60250 |
| Relative permittivity, 1MHz | 2.9 / 3.3 | - | IEC 60250 |
| Dissipation factor, 1MHz | 150 / 550 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 / 1E11 | Ohm*m | IEC 60093 |
| Surface resistivity | * / 1E14 | Ohm | IEC 60093 |
| Comparative tracking index | 600 / 600 | - | IEC 60112 |
| Other properties | dry / cond | Unit | Test Standard |
| Humidity absorption | 1.2 / * | % | Sim. to ISO 62 |
| Density | 1070 / - | kg/m³ | ISO 1183 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 928 | kg/m³ | - |
| Thermal conductivity of melt | 0.156 | W/(m K) | - |
| Spec. heat capacity of melt | 2410 | J/(kg K) | - |
| Ejection temperature | 90 | °C | - |
Diagrams
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Special Characteristics
Anti-static
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 2 - 4 h
PROCESSING
injection molding, Melt temperature, range: 240 - 270 °C
injection molding, Melt temperature, recommended: 260 °C
injection molding, Mold temperature, range: 40 - 80 °C
injection molding, Mold temperature, recommended: 60 °C
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 2 - 4 h
PROCESSING
injection molding, Melt temperature, range: 240 - 270 °C
injection molding, Melt temperature, recommended: 260 °C
injection molding, Mold temperature, range: 40 - 80 °C
injection molding, Mold temperature, recommended: 60 °C
Chemical Media Resistance
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact
Styrolution GmbH
Styrolution Infopoint
mailto:styrenics.infopoint@basf.com
Tel: +49 621 60 41446
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact
Styrolution GmbH
Styrolution Infopoint
mailto:styrenics.infopoint@basf.com
Tel: +49 621 60 41446
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012
CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012













