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CAMPUS® datasheet | Ultraform® W2320 003 Q600


This datasheet of Ultraform® W2320 003 Q600 from BASF is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Rheological calculation properties - Test specimen production - Diagrams
  Ultraform® W2320 003 Q600 | POM | BASF
Product Texts
Very free-flowing, rapidly solidifying grade for use where processing is extremely difficult but mechanical properties are lower.

Abbreviated designation according to ISO 1043: POM
Designation according to ISO 9988-1: POM-K, M-GNR, 05-002
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Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 25 cm³/10min ISO 1133
Temperature 190 °C ISO 1133
Load 2.16 kg ISO 1133
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2800 MPa ISO 527-1/-2
Yield stress 65 MPa ISO 527-1/-2
Yield strain 7.5 % ISO 527-1/-2
Nominal strain at break 24 % ISO 527-1/-2
Tensile creep modulus, 1h 2100 MPa ISO 899-1
Tensile creep modulus, 1000h 1350 MPa ISO 899-1
Charpy impact strength, +23°C 150 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 150 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 4 kJ/m² ISO 179/1eA
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Thermal propertiesValueUnitTest Standard
Melting temperature, 10°C/min 167 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 100 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 156 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 150 °C ISO 306
Coeff. of linear therm. expansion, parallel 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
UL recognition UL - -
Oxygen index 15 % ISO 4589-1/-2
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Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 3.8 - IEC 60250
Relative permittivity, 1MHz 3.8 - IEC 60250
Dissipation factor, 100Hz 10 E-4 IEC 60250
Dissipation factor, 1MHz 50 E-4 IEC 60250
Volume resistivity 1E13 Ohm*m IEC 60093
Surface resistivity 1E13 Ohm IEC 60093
Electric strength 40 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
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Other propertiesValueUnitTest Standard
Water absorption 0.8 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1400 kg/m³ ISO 1183
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Rheological calculation propertiesValueUnitTest Standard
Ejection temperature 110 °C -
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Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 200 °C ISO 294
Injection Molding, mold temperature 90 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
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Diagrams
Viscosity-shear rate , Ultraform® W2320 003 Q600, POM, BASF
Shearstress-shear rate , Ultraform® W2320 003 Q600, POM, BASF
Dynamic Shear modulus-temperature , Ultraform® W2320 003 Q600, POM, BASF
Stress-strain , Ultraform® W2320 003 Q600, POM, BASF
Secant modulus-strain , Ultraform® W2320 003 Q600, POM, BASF
Stress-strain (isochronous) 23°C, Ultraform® W2320 003 Q600, POM, BASF
Creep modulus-time 23°C, Ultraform® W2320 003 Q600, POM, BASF
Stress-strain (isochronous) 40°C, Ultraform® W2320 003 Q600, POM, BASF
Creep modulus-time 40°C, Ultraform® W2320 003 Q600, POM, BASF
Stress-strain (isochronous) 60°C, Ultraform® W2320 003 Q600, POM, BASF
Creep modulus-time 60°C, Ultraform® W2320 003 Q600, POM, BASF
Stress-strain (isochronous) 80°C, Ultraform® W2320 003 Q600, POM, BASF
Creep modulus-time 80°C, Ultraform® W2320 003 Q600, POM, BASF
Stress-strain (isochronous) 100°C, Ultraform® W2320 003 Q600, POM, BASF
Creep modulus-time 100°C, Ultraform® W2320 003 Q600, POM, BASF
Stress-strain (isochronous) 120°C, Ultraform® W2320 003 Q600, POM, BASF
Creep modulus-time 120°C, Ultraform® W2320 003 Q600, POM, BASF
Specific volume-temperature (pvT) , Ultraform® W2320 003 Q600, POM, BASF
Tensile modulus-temperature , Ultraform® W2320 003 Q600, POM, BASF
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Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Regional Availability
North America
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Other text information
Injection molding
PROCESSING
injection molding, Melt temperature, range: 185 - 230 °C
injection molding, Melt temperature, recommended: 200 °C
injection molding, Mold temperature, range: 60 - 100 °C
injection molding, Mold temperature, recommended: 90 °C
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Chemical Media Resistance
Acids
Acetic Acid (5% by mass) (23°C)
Lactic Acid (10% by mass) (23°C)
Hydrochloric Acid (36% by mass) (23°C)
Nitric Acid (40% by mass) (23°C)
Sulfuric Acid (38% by mass) (23°C)
Sulfuric Acid (5% by mass) (23°C)
Chromic Acid solution (40% by mass) (23°C)
Bases
Sodium Hydroxide solution (35% by mass) (23°C)
Sodium Hydroxide solution (1% by mass) (23°C)
Ammonium Hydroxide solution (10% by mass) (23°C)
Alcohols
Isopropyl alcohol (23°C)
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
n-Hexane (23°C)
Toluene (23°C)
iso-Octane (23°C)
Ketones
Acetone (23°C)
Ethers
Diethyl ether (23°C)
Mineral oils
SAE 10W40 multigrade motor oil (130°C)
SAE 80/90 hypoid-gear oil (130°C)
Standard Fuels
ISO 1817 Liquid 1 (60°C)
ISO 1817 Liquid 2 (60°C)
ISO 1817 Liquid 3 (60°C)
ISO 1817 Liquid 4 (60°C)
Standard fuel without alcohol (pref. ISO 1817 Liquid C) (23°C)
Standard fuel with alcohol (pref. ISO 1817 Liquid 4) (23°C)
Diesel fuel (pref. ISO 1817 Liquid F) (23°C)
Diesel fuel (pref. ISO 1817 Liquid F) (>90°C)
Salt solutions
Sodium Chloride solution (10% by mass) (23°C)
Sodium Hypochlorite solution (10% by mass) (23°C)
Sodium Carbonate solution (20% by mass) (23°C)
Sodium Carbonate solution (2% by mass) (23°C)
Other
Ethyl Acetate (23°C)
Hydrogen peroxide (23°C)
DOT No. 4 Brake fluid (130°C)
Ethylene Glycol (50% by mass) in water (108°C)
50% Oleic acid + 50% Olive Oil (23°C)
Water (23°C)
Deionized water (90°C)
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Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. PM/K
Fax: 0621-60-49497
e-mail: e-mail

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
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The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012