View list of
  • All BASF grades
  • All POM grades
  • All grades beginning with U

CAMPUS® datasheet | Ultraform® Z2320 003


This datasheet of Ultraform® Z2320 003 from BASF is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Test specimen production - Diagrams
  Ultraform® Z2320 003 | POM | BASF
Product Texts
Extremely easy flowing grade for very thin-walled moldings with difficult flow path to wall thickness ratios and very short cycle times.

Abbreviated designation according to ISO 1043: POM
Designation according to ISO 9988-1: POM-K, M-GNR, 06-002
top
Rheological propertiesValueUnitTest Standard
Melt volume-flow rate (MVR) 42 cm³/10min ISO 1133
Temperature 190 °C ISO 1133
Load 2.16 kg ISO 1133
Molding shrinkage (parallel) 2.0 % ISO 294-4, 2577
Molding shrinkage (normal) 2.1 % ISO 294-4, 2577
top
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 2800 MPa ISO 527-1/-2
Yield stress 65 MPa ISO 527-1/-2
Yield strain 7 % ISO 527-1/-2
Nominal strain at break 20 % ISO 527-1/-2
Tensile creep modulus (1h) 2100 MPa ISO 899-1
Tensile creep modulus (1000h) 1350 MPa ISO 899-1
Charpy impact strength (+23°C) 130 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 130 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 5.5 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 4.5 kJ/m² ISO 179/1eA
top
Thermal propertiesValueUnitTest Standard
Melting temperature (10°C/min) 166 °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 105 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 150 °C ISO 306
Coeff. of linear therm. expansion (parallel) 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
UL recognition UL - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm IEC 60695-11-10
UL recognition UL - -
Oxygen index 15 % ISO 4589-1/-2
top
Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 3.8 - IEC 60250
Relative permittivity (1MHz) 3.8 - IEC 60250
Dissipation factor (100Hz) 10 E-4 IEC 60250
Dissipation factor (1MHz) 50 E-4 IEC 60250
Volume resistivity 1E13 Ohm*m IEC 60093
Surface resistivity 1E13 Ohm IEC 60093
Electric strength 40 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
top
Other propertiesValueUnitTest Standard
Water absorption 0.8 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1400 kg/m³ ISO 1183
top
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 200 °C ISO 294
Injection Molding, mold temperature 90 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
top
Diagrams
Dynamic Shear modulus-temperature , Ultraform® Z2320 003, POM, BASF
top
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
top
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .2 %
Pre/Post-processing, Pre-drying, Temperature: 100 °C
Pre/Post-processing, Pre-drying, Time: 3 h

PROCESSING
injection molding, Melt temperature, range: 190 - 230 °C
injection molding, Melt temperature, recommended: 200 °C
injection molding, Mold temperature, range: 60 - 120 °C
injection molding, Mold temperature, recommended: 90 °C
injection molding, Dwell time, thermoplastics: 1 0 min

Processing

Usual single-flighted three-section screws with an effective screw length of at least 15 D, better 20 - 23 D are suitable for the injection molding of Ultraform.

Pretreatment

Granules or pellets in original packaging can be processed without any special pretreatment. Granules or pellets which have become moist due to prolonged or incorrect storage (e.g. by formation of condensed water) must be dried in dehumidifying or recirculating air dryers for approx. 3 hours at about 100 - 110 °C. The moisture content should not exceed 0.2 %.


Postprocessing
top
Chemical Media Resistance
Acids
Hydrochloric Acid (36% by mass) (23°C)
Nitric Acid (40% by mass) (23°C)
Sulfuric Acid (38% by mass) (23°C)
Sulfuric Acid (5% by mass) (23°C)
Chromic Acid solution (40% by mass) (23°C)
Mineral oils
SAE 10W40 multigrade motor oil (130°C)
SAE 80/90 hypoid-gear oil (130°C)
Standard Fuels
Diesel fuel (pref. ISO 1817 Liquid F) (>90°C)
Salt solutions
Sodium Hypochlorite solution (10% by mass) (23°C)
Other
Hydrogen peroxide (23°C)
top
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
top

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991