View list of
  • All BASF grades
  • All PA66 grades
  • All grades beginning with U

CAMPUS® datasheet | Ultramid® 1703-2 BK ND3007


This datasheet of Ultramid® 1703-2 BK ND3007 from BASF is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  Ultramid® 1703-2 BK ND3007 | PA66-GF25 | BASF
Product Texts
Ultramid® 1703-2 BK ND3007 is a 25% glass reinforced, heat stabilized, pigmented black injection molding PA6/6.
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 8800 / 6300 MPa ISO 527-1/-2
Stress at break 180 / 124 MPa ISO 527-1/-2
Strain at break 3 / 5 % ISO 527-1/-2
Charpy impact strength (+23°C) 70 / 80 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 55 / 56 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 10 / 11 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) - / 9 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 257 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 250 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 262 / * °C ISO 75-1/-2
Other propertiesdry / condUnitTest Standard
Water absorption 6.4 / * % Sim. to ISO 62
Humidity absorption 1.9 / * % Sim. to ISO 62
Density 1330 / - kg/m³ ISO 1183
Characteristics
Regional Availability
North America
Other text information
Injection molding
PA66 materials must be properly dried in order to provide parts with optimum strength and toughness. PA66 materials are hygroscopic and will become degraded by excessive moisture during the injection molding process. For unopened bag/box, dry at 140F (60°C) for 1-2 hours. For material exposed to the atmosphere, if additional drying is needed, dry at 150F (66°C) or until the moisture level is between 0.04 - 0.20%.

Melt Temperature: 288 - 305°C (550 - 580F)
Mold Temperature: 6 0 - 100°C (140 - 212F)
Injection Pressure: 35 - 125 MPa (5000 - 18000 psi)
Back Pressure: 0 - 0.35 MPa (0 - 50 psi)
Screw RPM 40 - 80
Screw Compression Ratio:3:1 - 4:1

This product can be processed over a wide range of mold temperatures; however, for applications where aesthetics are critical, a mold surface temperature of 60-100°C (140-212F) is recommended.

Injection pressure controls the filling of the part and should be applied for 90% of ram travel. Pac king pressure affects the final part and can be used effectively in controlling sink marks and shrinkage. It should be applied and maintained until the gate area is completely frozen off.

Fast fill rates are recommended to insure uniform melt delivery to the cavity and prevent premature freezing.
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991