View list of
Graphical Display of Values (Scatter Plot, Polar Chart)?
View Datasheet in other language
FREE DOWNLOAD
Interested inGraphical Display of Values (Scatter Plot, Polar Chart)?
The CAMPUS desktop version
offers extended functionality!CAMPUS® datasheet | Ultramid® 8202C HS BK-102
This datasheet of Ultramid® 8202C HS BK-102 from BASF is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
Ultramid® 8202C HS BK-102 | PA6 | BASF
Product Texts
Ultramid® 8202C HS is a heat stabilized, low viscosity, Polyamid 6 injection molding homopolymer possessing a modified crystalline structure for increased property performance and faster cycles. It is also available in pigmented versions.
Ultramid® 8202C HS is generally recommended for applications such as gears, valves, fittings, insulators, bushings, slides, window hardware, wiring devices, textile components and furniture casters.
Ultramid® 8202C HS is generally recommended for applications such as gears, valves, fittings, insulators, bushings, slides, window hardware, wiring devices, textile components and furniture casters.
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 3700 / 1360 | MPa | ISO 527-1/-2 |
| Yield stress | 88 / 43 | MPa | ISO 527-1/-2 |
| Yield strain | 4 / 22 | % | ISO 527-1/-2 |
| Nominal strain at break | 7 / >50 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | N / - | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 3.5 / - | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 220 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 65 / * | °C | ISO 75-1/-2 |
| Burning Behav. at thickness h | V-2 / * | class | IEC 60695-11-10 |
| Thickness tested | 0.7 / * | mm | IEC 60695-11-10 |
| UL recognition | UL / * | - | - |
| Electrical properties | dry / cond | Unit | Test Standard |
| Volume resistivity | >1E13 / - | Ohm*m | IEC 60093 |
| Comparative tracking index | - / 600 | - | IEC 60112 |
| Other properties | dry / cond | Unit | Test Standard |
| Water absorption | 9.3 / * | % | Sim. to ISO 62 |
| Humidity absorption | 2.6 / * | % | Sim. to ISO 62 |
| Density | 1130 / * | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 260 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
Diagrams
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
North America
Other text information
Injection molding
PREPROCESSING
Max. Water content: 0.2%
Product is supplied in sealed containers and drying prior to molding is not required. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80 °C (176 °F) is recommended. Drying time is dependent on moisture level.
Further information concerning safe handling procedures can be obtained from the Material Safety Data Sheet. Alternatively, please contact your BASF representative.
PROCESSING
Melt Temperatur e 240-280 °C (464-536 °F)
Mold Temperature 80-95 °C (176-203 °F)
Injection and Packing Pressure 35-125 bar (500-1500 psi)
A mold temperature of 80-95 °C (176-203 °F) is recommended, but temperatures of as low as 10 °C (50 °F) can be used where applicable.
Injection pressure controls the filling of the part and should be applied for 90% of ram travel. Packing pressure affects the final part and can be used effectively in controlling sink marks and shrinkage. It should be applied and maintained until the gate area is completely frozen off.
Fast fill rates are recommended to insure uniform melt delivery to the cavity and prevent premature freezing.
Max. Water content: 0.2%
Product is supplied in sealed containers and drying prior to molding is not required. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80 °C (176 °F) is recommended. Drying time is dependent on moisture level.
Further information concerning safe handling procedures can be obtained from the Material Safety Data Sheet. Alternatively, please contact your BASF representative.
PROCESSING
Melt Temperatur e 240-280 °C (464-536 °F)
Mold Temperature 80-95 °C (176-203 °F)
Injection and Packing Pressure 35-125 bar (500-1500 psi)
A mold temperature of 80-95 °C (176-203 °F) is recommended, but temperatures of as low as 10 °C (50 °F) can be used where applicable.
Injection pressure controls the filling of the part and should be applied for 90% of ram travel. Packing pressure affects the final part and can be used effectively in controlling sink marks and shrinkage. It should be applied and maintained until the gate area is completely frozen off.
Fast fill rates are recommended to insure uniform melt delivery to the cavity and prevent premature freezing.
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991