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offers extended functionality!CAMPUS® datasheet | Ultramid® 8272G HS BK-102
This datasheet of Ultramid® 8272G HS BK-102 from BASF is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
Ultramid® 8272G HS BK-102 | PA6-GF12 | BASF
Product Texts
Ultramid® 8272G HS BK-102 is a 12% glass fiber reinforced, black pigmented, thermally modified, Polyamid 6 blow molding compound offering an excellent balance of engineering properties combined with the melt strength ideally suited for blow molding and other applications requiring ultra high melt viscosity. It exhibits improved strength, stiffness and creep resistance compare to standard blow molding grades. Outstanding permeability and chemical resistance to oils, hydrocarbons and most solvent
s are other advantages along with excellent stiffness and the ability to fabricate complex shapes for cost effective metal replacements.
Ultramid® 8272G HS BK-102 is designed for blow molding applications requiring improved short term thermal performance as well as extrusions. It is ideal for air ducts, reservoirs and covers.
Ultramid® 8272G HS BK-102 is designed for blow molding applications requiring improved short term thermal performance as well as extrusions. It is ideal for air ducts, reservoirs and covers.
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 5220 / 3100 | MPa | ISO 527-1/-2 |
| Yield stress | - / 65 | MPa | ISO 527-1/-2 |
| Yield strain | - / 15 | % | ISO 527-1/-2 |
| Nominal strain at break | - / 20 | % | ISO 527-1/-2 |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 220 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 170 / * | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 210 / * | °C | ISO 75-1/-2 |
| Coeff. of linear therm. expansion (parallel) | 28 / * | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 72 / * | E-6/K | ISO 11359-1/-2 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Volume resistivity | >1E13 / >1E13 | Ohm*m | IEC 60093 |
| Other properties | dry / cond | Unit | Test Standard |
| Water absorption | 8.3 / * | % | Sim. to ISO 62 |
| Humidity absorption | 2.3 / * | % | Sim. to ISO 62 |
| Density | 1220 / * | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 275 | °C | ISO 294 |
| Injection Molding, mold temperature | 95 | °C | ISO 10724 |
Diagrams
Characteristics
Processing
Injection Molding, Blow Molding
Delivery form
Pellets
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
North America
Other text information
Blow molding
PREPROCESSING
Max. Water content: 0.15%
Product is supplied in sealed containers and
drying prior to molding is not required. If drying
becomes necessary, a dehumidifying or desiccant dryer
operating at 80 degC (176 degF) is recommended. Drying time is
dependent on moisture level.
Further information concerning safe handling procedures
can be obtained from the Material Safety Data Sheet.
Alternatively, please contact your BASF representative.
PROCESSING
Melt Temperature 245-260 degC (473-500 degF)
Mold Temperature 60 degC (140 degF)
Blow Ratio 2:1
Mold temperatures of 60 degC (140 degF) are generally recommended;
however, surface temperatures of 10-95 degC (50-203 degF) can be
used where applicable. The degree of crystallinity of thin
polyamide wall sections, 0.6mm (.023") or less, may be controlled
by the temperature of the mold. A cold mold, 5-30 degC (41-86 degF),
will rapidly quench the section producing a clear, relatively
flexible part, while a hot mold, over 40 degC (104 degF), will
produce an opaque part with increased stiffness.
A diametrical blow ratio of 2:1 is generally recommended for
plain symmetrical parts. As part complexity increases, lower
blow ratios should be utilized to prevent thin wall cross
sections, especially in corners.
Max. Water content: 0.15%
Product is supplied in sealed containers and
drying prior to molding is not required. If drying
becomes necessary, a dehumidifying or desiccant dryer
operating at 80 degC (176 degF) is recommended. Drying time is
dependent on moisture level.
Further information concerning safe handling procedures
can be obtained from the Material Safety Data Sheet.
Alternatively, please contact your BASF representative.
PROCESSING
Melt Temperature 245-260 degC (473-500 degF)
Mold Temperature 60 degC (140 degF)
Blow Ratio 2:1
Mold temperatures of 60 degC (140 degF) are generally recommended;
however, surface temperatures of 10-95 degC (50-203 degF) can be
used where applicable. The degree of crystallinity of thin
polyamide wall sections, 0.6mm (.023") or less, may be controlled
by the temperature of the mold. A cold mold, 5-30 degC (41-86 degF),
will rapidly quench the section producing a clear, relatively
flexible part, while a hot mold, over 40 degC (104 degF), will
produce an opaque part with increased stiffness.
A diametrical blow ratio of 2:1 is generally recommended for
plain symmetrical parts. As part complexity increases, lower
blow ratios should be utilized to prevent thin wall cross
sections, especially in corners.
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991