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CAMPUS® datasheet | Ultramid® A3K


This datasheet of Ultramid® A3K from BASF is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  Ultramid® A3K | PA66 | BASF
Product Texts
Easy flowing injection moulding grade for fast processing. Uses include highly stressed technical parts such as bearings and gear wheels. Also electrically insulating parts such as terminals and cable connectors.
Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 120 / * cm³/10min ISO 1133
Temperature 275 / * °C ISO 1133
Load 5 / * kg ISO 1133
Molding shrinkage (parallel) 1.4 / * % ISO 294-4, 2577
Molding shrinkage (normal) 1.7 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 3100 / 1100 MPa ISO 527-1/-2
Yield stress 85 / 50 MPa ISO 527-1/-2
Yield strain 5 / 20 % ISO 527-1/-2
Nominal strain at break 30 / >50 % ISO 527-1/-2
Tensile creep modulus (1h) * / 1100 MPa ISO 899-1
Tensile creep modulus (1000h) * / 700 MPa ISO 899-1
Charpy impact strength (+23°C) N / N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / - kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 5 / 20 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 4 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 260 / * °C ISO 11357-1/-3
Glass transition temperature (10°C/min) 72 / * °C ISO 11357-1/-2
Temp. of deflection under load (1.80 MPa) 75 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 220 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 250 / * °C ISO 306
Coeff. of linear therm. expansion (parallel) 85 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. V-2 / * class IEC 60695-11-10
Thickness tested 1.5 / * mm IEC 60695-11-10
UL recognition UL / * - -
Burning Behav. at thickness h V-2 / * class IEC 60695-11-10
Thickness tested 0.4 / * mm IEC 60695-11-10
UL recognition UL / * - -
Oxygen index 28 / * % ISO 4589-1/-2
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 3.8 / - - IEC 60250
Relative permittivity (1MHz) 3.2 / 5 - IEC 60250
Dissipation factor (100Hz) 50 / - E-4 IEC 60250
Dissipation factor (1MHz) 250 / 2000 E-4 IEC 60250
Volume resistivity 1E13 / 1E10 Ohm*m IEC 60093
Surface resistivity * / 1E10 Ohm IEC 60093
Electric strength 41 / 29 kV/mm IEC 60243-1
Comparative tracking index - / 600 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 8.5 / * % Sim. to ISO 62
Humidity absorption 2.8 / * % Sim. to ISO 62
Density 1130 / - kg/m³ ISO 1183
Material specific propertiesdry / condUnitTest Standard
Viscosity number 150 / * cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Ejection temperature 180 °C -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 290 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Diagrams
Viscosity-shear rate , Ultramid® A3K, PA66, BASF
Shearstress-shear rate , Ultramid® A3K, PA66, BASF
Dynamic Shear modulus-temperature , Ultramid® A3K, PA66, BASF
Dynamic Shear modulus-temperature , Ultramid® A3K, PA66, BASF
Stress-strain , Ultramid® A3K, PA66, BASF
Stress-strain , Ultramid® A3K, PA66, BASF
Secant modulus-strain , Ultramid® A3K, PA66, BASF
Secant modulus-strain , Ultramid® A3K, PA66, BASF
Stress-strain (isochronous) 23°C, Ultramid® A3K, PA66, BASF
Creep modulus-time 23°C, Ultramid® A3K, PA66, BASF
Stress-strain (isochronous) 60°C, Ultramid® A3K, PA66, BASF
Creep modulus-time 60°C, Ultramid® A3K, PA66, BASF
Stress-strain (isochronous) 90°C, Ultramid® A3K, PA66, BASF
Creep modulus-time 90°C, Ultramid® A3K, PA66, BASF
Stress-strain (isochronous) 120°C, Ultramid® A3K, PA66, BASF
Creep modulus-time 120°C, Ultramid® A3K, PA66, BASF
Specific volume-temperature (pvT) , Ultramid® A3K, PA66, BASF
Tensile modulus-temperature , Ultramid® A3K, PA66, BASF
Tensile modulus-temperature , Ultramid® A3K, PA66, BASF
Characteristics
Processing
Injection Molding, Other Extrusion
Delivery form
Pellets
Additives
Lubricants, Release agent
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .15 %
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
injection molding, Melt temperature, range: 280 - 300 °C
injection molding, Melt temperature, recommended: 290 °C
injection molding, Mold temperature, range: 60 - 80 °C
injection molding, Mold temperature, recommended: 60 °C
injection molding, Dwell time, thermoplastics: 10 min
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail

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Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991