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CAMPUS® datasheet | Ultramid® A3L HP


This datasheet of Ultramid® A3L HP from BASF is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  Ultramid® A3L HP | PA66 | BASF
Product Texts
Ultramid A3L HP is an unreinforced, impact modified, high flow, Polyamid 66 for injection molding. This grade has excellent flow and improved ambient and low temperature toughness.

Typical applications include fasteners and clamps.
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 2440 / - MPa ISO 527-1/-2
Yield stress 63.5 / - MPa ISO 527-1/-2
Yield strain 6.2 / - % ISO 527-1/-2
Nominal strain at break 28 / - % ISO 527-1/-2
Charpy notched impact strength (+23°C) 19 / - kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 14 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 262 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 70 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 192 / * °C ISO 75-1/-2
Other propertiesdry / condUnitTest Standard
Density 1100 / - kg/m³ ISO 1183
Characteristics
Processing
Injection Molding
Regional Availability
North America
Other text information
Injection molding
Nylon 66 materials must be properly dried in order to provide parts
with optimum strength and toughness. Nylon 66 materials are
hygroscopic and will become degraded by excessive moisture during the
injection molding process. For unopened bag/box, dry at 140F (60C) for
1-2 hours. For material exposed to the atmosphere, if additional
drying is needed, dry at 150F (66C) or until the moisture level is
between 0.04 - 0.20%.
PROCESSING
Melt Temperature: 288 – 305C (550 – 580F)
Mold Temperature: 60 – 100C (140 – 212F)
Injection Pressure: 35 – 125 MPa (5000 – 18000 psi)
Back Pressure: 0 – 0.35 MPa (0 – 50 psi)
Screw RPM 40 – 80
Screw Compression Ratio:3:1 – 4:1

This product can be processed over a wide range of mold
temperatures; however, for applications where aesthetics are
critical, a mold surface temperature of 60-100C (140-212F)
is recommended.

Injection pressure controls the filling of the part and should
be applied for 90% of ram travel. Packing pressure affects
the final part and can be used effectively in controlling
sink marks and shrinkage. It should be applied and maintained
until the gate area is completely frozen off.

Fast fill rates are recommended to insure uniform melt
delivery to the cavity and prevent premature freezing.
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail

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Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991