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CAMPUS® datasheet | Ultramid® C3U


This datasheet of Ultramid® C3U from BASF is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  Ultramid® C3U | PA666 FR | BASF
Product Texts
Injection moulding grade with improved flame retardance (free from halogens), used e.g. for impact resistant electrical insulating parts such as contact bases and plug connector strips.
Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate (MVR) 160 / * cm³/10min ISO 1133
Temperature 275 / * °C ISO 1133
Load 5 / * kg ISO 1133
Molding shrinkage (parallel) 1.2 / * % ISO 294-4, 2577
Molding shrinkage (normal) 1.3 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 3500 / 1500 MPa ISO 527-1/-2
Yield stress 75 / 45 MPa ISO 527-1/-2
Yield strain 4 / 20 % ISO 527-1/-2
Nominal strain at break 6 / >50 % ISO 527-1/-2
Tensile creep modulus (1h) * / 1000 MPa ISO 899-1
Tensile creep modulus (1000h) * / 890 MPa ISO 899-1
Charpy impact strength (+23°C) 80 / N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 6 / 35 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 4 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 243 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 70 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 210 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 250 / * °C ISO 306
Coeff. of linear therm. expansion (parallel) 80 / * E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 90 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. V-0 / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
UL recognition UL / * - -
Burning Behav. at thickness h V-0 / * class IEC 60695-11-10
Thickness tested 0.4 / * mm IEC 60695-11-10
UL recognition UL / * - -
Oxygen index 34 / * % ISO 4589-1/-2
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (1MHz) 3.6 / 6 - IEC 60250
Dissipation factor (1MHz) 200 / 3000 E-4 IEC 60250
Volume resistivity 1E13 / 1E9 Ohm*m IEC 60093
Surface resistivity * / 1E10 Ohm IEC 60093
Electric strength 32 / 28 kV/mm IEC 60243-1
Comparative tracking index - / 600 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 8.5 / * % Sim. to ISO 62
Humidity absorption 2.9 / * % Sim. to ISO 62
Density 1160 / - kg/m³ ISO 1183
Material specific propertiesdry / condUnitTest Standard
Viscosity number 145 / * cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Density of melt 1010 kg/m³ -
Thermal conductivity of melt 0.145 W/(m K) -
Spec. heat capacity melt 2500 J/(kg K) -
Ejection temperature 190 °C -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 270 °C ISO 294
Injection Molding, mold temperature 60 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Diagrams
Viscosity-shear rate , Ultramid® C3U, PA666 FR, BASF
Shearstress-shear rate , Ultramid® C3U, PA666 FR, BASF
Dynamic Shear modulus-temperature , Ultramid® C3U, PA666 FR, BASF
Stress-strain , Ultramid® C3U, PA666 FR, BASF
Stress-strain , Ultramid® C3U, PA666 FR, BASF
Secant modulus-strain , Ultramid® C3U, PA666 FR, BASF
Secant modulus-strain , Ultramid® C3U, PA666 FR, BASF
Stress-strain (isochronous) 23°C, Ultramid® C3U, PA666 FR, BASF
Creep modulus-time 23°C, Ultramid® C3U, PA666 FR, BASF
Stress-strain (isochronous) 90°C, Ultramid® C3U, PA666 FR, BASF
Creep modulus-time 90°C, Ultramid® C3U, PA666 FR, BASF
Stress-strain (isochronous) 140°C, Ultramid® C3U, PA666 FR, BASF
Creep modulus-time 140°C, Ultramid® C3U, PA666 FR, BASF
Specific volume-temperature (pvT) , Ultramid® C3U, PA666 FR, BASF
Tensile modulus-temperature , Ultramid® C3U, PA666 FR, BASF
Tensile modulus-temperature , Ultramid® C3U, PA666 FR, BASF
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Special Characteristics
Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .15 %
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
injection molding, Melt temperature, range: 250 - 270 °C
injection molding, Melt temperature, recommended: 260 °C
injection molding, Mold temperature, range: 60 - 80 °C
injection molding, Mold temperature, recommended: 70 °C
injection molding, Dwell time, thermoplastics: 10 min
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991