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This datasheet of Ultramid® NFX-0102 NF2004 from BASF is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
Ultramid® NFX-0102 NF2004 | PA66-GF30 | BASF
Product Texts
Ultramid® NFX-0102 NF2004 is a heat stabilized, 30% glass bead PA66 injection molding grade. It is especially formulated for low warp, increased stiffness and excellent dimensional stability.
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 4500 / - | MPa | ISO 527-1/-2 |
| Stress at break | 70 / - | MPa | ISO 527-1/-2 |
| Strain at break | 2.5 / - | % | ISO 527-1/-2 |
| Charpy notched impact strength (+23°C) | 2.5 / - | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 263 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 85 / * | °C | ISO 75-1/-2 |
| Other properties | dry / cond | Unit | Test Standard |
| Density | 1360 / - | kg/m³ | ISO 1183 |
Characteristics
Regional Availability
North America
Other text information
Injection molding
Polyamid 66 materials must be properly dried in order to provide parts with optimum strength and toughness. Polyamid 66 materials are hygroscopic and will become degraded by excessive moisture during the injection molding process. For unopened bag/box, dry at 140F (60°C) for 1-2 hours. For material exposed to the atmosphere, if additional drying is needed, dry at 150F (66°C) or until the moisture level is between 0.04 - 0.20%.
Melt Temperature: 288 – 305°C (550 – 580F)
M old Temperature: 60 – 100°C (140 – 212F)
Injection Pressure: 35 – 125 MPa (5000 – 18000 psi)
Back Pressure: 0 – 0.35 MPa (0 – 50 psi)
Screw RPM 40 – 80
Screw Compression Ratio:3:1 – 4:1
This product can be processed over a wide range of mold temperatures; however, for applications where aesthetics arecritical, a mold surface temperature of 60-100°C (140-212F) is recommended.
Injection pressure controls the filling of the part and should be a pplied for 90% of ram travel. Packing pressure affects the final part and can be used effectively in controlling sink marks and shrinkage. It should be applied and maintained until the gate area is completely frozen off.
Fast fill rates are recommended to insure uniform melt delivery to the cavity and prevent premature freezing.
Melt Temperature: 288 – 305°C (550 – 580F)
M old Temperature: 60 – 100°C (140 – 212F)
Injection Pressure: 35 – 125 MPa (5000 – 18000 psi)
Back Pressure: 0 – 0.35 MPa (0 – 50 psi)
Screw RPM 40 – 80
Screw Compression Ratio:3:1 – 4:1
This product can be processed over a wide range of mold temperatures; however, for applications where aesthetics arecritical, a mold surface temperature of 60-100°C (140-212F) is recommended.
Injection pressure controls the filling of the part and should be a pplied for 90% of ram travel. Packing pressure affects the final part and can be used effectively in controlling sink marks and shrinkage. It should be applied and maintained until the gate area is completely frozen off.
Fast fill rates are recommended to insure uniform melt delivery to the cavity and prevent premature freezing.
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991