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This datasheet of Ultramid® S3K Balance from BASF is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
Ultramid® S3K Balance | PA610 | BASF
Product Texts
Easy flowing, stabilized product for fast processing.
| Rheological properties | dry / cond | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 120 / * | cm³/10min | ISO 1133 |
| Temperature | 275 / * | °C | ISO 1133 |
| Load | 5 / * | kg | ISO 1133 |
| Molding shrinkage (parallel) | 1.6 / * | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 1.9 / * | % | ISO 294-4, 2577 |
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 2400 / 1100 | MPa | ISO 527-1/-2 |
| Yield stress | 65 / 50 | MPa | ISO 527-1/-2 |
| Yield strain | 4.5 / 20 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | N / N | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 300 / - | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 5 / 10 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 3 / - | kJ/m² | ISO 179/1eA |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 220 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 65 / * | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 140 / * | °C | ISO 75-1/-2 |
| Coeff. of linear therm. expansion (parallel) | 110 / * | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 120 / * | E-6/K | ISO 11359-1/-2 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Surface resistivity | * / >1E15 | Ohm | IEC 60093 |
| Electric strength | - / 44 | kV/mm | IEC 60243-1 |
| Comparative tracking index | - / 600 | - | IEC 60112 |
| Other properties | dry / cond | Unit | Test Standard |
| Water absorption | 3.6 / * | % | Sim. to ISO 62 |
| Humidity absorption | 1.4 / * | % | Sim. to ISO 62 |
| Density | 1080 / - | kg/m³ | ISO 1183 |
| Material specific properties | dry / cond | Unit | Test Standard |
| Viscosity number | 150 / * | cm³/g | ISO 307, 1157, 1628 |
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .15 %
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 4 h
PROCESSING
injection molding, Melt temperature, range: 250 - 270 °C
injection molding, Melt temperature, recommended: 260 °C
injection molding, Mold temperature, range: 40 - 60 °C
injection molding, Mold temperature, recommended: 60 °C
injection molding, Dwell time, thermoplastics: 10 min
Pre/Post-processing, max. allowed water content: .15 %
Pre/Post-processing, Pre-drying, Temperature: 80 °C
Pre/Post-processing, Pre-drying, Time: 4 h
PROCESSING
injection molding, Melt temperature, range: 250 - 270 °C
injection molding, Melt temperature, recommended: 260 °C
injection molding, Mold temperature, range: 40 - 60 °C
injection molding, Mold temperature, recommended: 60 °C
injection molding, Dwell time, thermoplastics: 10 min
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991