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offers extended functionality!CAMPUS® datasheet | Ultramid® T KR 4355 G10 bk
This datasheet of Ultramid® T KR 4355 G10 bk from BASF is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
Ultramid® T KR 4355 G10 bk | PA6/6T-GF50 | BASF
Product Texts
Glass fibre reinforced partially aromatic polyamide for injection moulding. High toughness, stiffness and strength, low water absorption, high melting point (285 °C).
| Rheological properties | dry / cond | Unit | Test Standard |
| Molding shrinkage (parallel) | 0.3 / * | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 0.9 / * | % | ISO 294-4, 2577 |
| Mechanical properties | dry / cond | Unit | Test Standard |
| Tensile Modulus | 17000 / - | MPa | ISO 527-1/-2 |
| Stress at break | 240 / - | MPa | ISO 527-1/-2 |
| Strain at break | 2.3 / - | % | ISO 527-1/-2 |
| Tensile creep modulus (1000h) | * / 10500 | MPa | ISO 899-1 |
| Charpy impact strength (+23°C) | 90 / 80 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 85 / 75 | kJ/m² | ISO 179/1eU |
| Thermal properties | dry / cond | Unit | Test Standard |
| Melting temperature (10°C/min) | 285 / * | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 245 / * | °C | ISO 75-1/-2 |
| Coeff. of linear therm. expansion (parallel) | 18 / * | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 70 / * | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 1.6 / * | mm | IEC 60695-11-10 |
| UL recognition | UL / * | - | - |
| Burning Behav. at thickness h | HB / * | class | IEC 60695-11-10 |
| Thickness tested | 1.6 / * | mm | IEC 60695-11-10 |
| Electrical properties | dry / cond | Unit | Test Standard |
| Relative permittivity (1MHz) | 4.7 / 4.8 | - | IEC 60250 |
| Dissipation factor (1MHz) | 200 / 300 | E-4 | IEC 60250 |
| Electric strength | 33 / 31 | kV/mm | IEC 60243-1 |
| Comparative tracking index | - / 600 | - | IEC 60112 |
| Other properties | dry / cond | Unit | Test Standard |
| Water absorption | 4 / * | % | Sim. to ISO 62 |
| Humidity absorption | 0.6 / * | % | Sim. to ISO 62 |
| Density | 1620 / - | kg/m³ | ISO 1183 |
| Material specific properties | dry / cond | Unit | Test Standard |
| Viscosity number | 135 / * | cm³/g | ISO 307, 1157, 1628 |
Characteristics
Processing
Injection Molding
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .15 %
Pre/Post-processing, Pre-drying, Temperature: 110 °C
Pre/Post-processing, Pre-drying, Time: 8 h
PROCESSING
injection molding, Melt temperature, range: 310 - 330 °C
injection molding, Melt temperature, recommended: 320 °C
injection molding, Mold temperature, range: 80 - 120 °C
injection molding, Mold temperature, recommended: 100 °C
injection molding, Dwell time, thermoplastics: 5 min
Pre/Post-processing, max. allowed water content: .15 %
Pre/Post-processing, Pre-drying, Temperature: 110 °C
Pre/Post-processing, Pre-drying, Time: 8 h
PROCESSING
injection molding, Melt temperature, range: 310 - 330 °C
injection molding, Melt temperature, recommended: 320 °C
injection molding, Mold temperature, range: 80 - 120 °C
injection molding, Mold temperature, recommended: 100 °C
injection molding, Dwell time, thermoplastics: 5 min
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.
In order to check the availability of products please contact us or our
sales agency.
For more information about our products contact your local BASF
representative or
BASF SE
Dept. KS/KC
Fax: 0621-60-49497
e-mail: e-mail
CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991