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CAMPUS® datasheet | Ultrason® S 3010 NAT


This datasheet of Ultrason® S 3010 NAT from BASF is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:

  Ultrason® S 3010 NAT | PSU | BASF
Product Texts
Unreinforced, higher viscosity injection moulding and extrusion grade, tougher and with improved chemical resistance.
Abbreviated designation according to ISO 1043-1: PSU
Rheological propertiesdry / condUnitTest Standard
Melt volume-flow rate, MVR 40 / * cm³/10min ISO 1133
Temperature 360 / * °C ISO 1133
Load 10 / * kg ISO 1133
Molding shrinkage, parallel 0.7 / * % ISO 294-4, 2577
Molding shrinkage, normal 0.7 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus - / 2550 MPa ISO 527-1/-2
Yield stress - / 75 MPa ISO 527-1/-2
Yield strain - / 6 % ISO 527-1/-2
Nominal strain at break - / >50 % ISO 527-1/-2
Tensile creep modulus, 1h * / 2500 MPa ISO 899-1
Charpy impact strength, +23°C - / N kJ/m² ISO 179/1eU
Charpy impact strength, -30°C - / N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C - / 5.5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C * / 6 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Glass transition temperature, 10°C/min 187 / * °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 177 / * °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 183 / * °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 183 / * °C ISO 306
Coeff. of linear therm. expansion, parallel 53 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
UL recognition UL / * - -
Burning Behav. at thickness h V-2 / * class IEC 60695-11-10
Thickness tested 3.0 / * mm IEC 60695-11-10
UL recognition UL / * - -
Oxygen index 32.1 / * % ISO 4589-1/-2
Electrical propertiesdry / condUnitTest Standard
Relative permittivity, 100Hz * / 3.1 - IEC 60250
Relative permittivity, 1MHz * / 3.1 - IEC 60250
Dissipation factor, 100Hz * / 8 E-4 IEC 60250
Dissipation factor, 1MHz * / 64 E-4 IEC 60250
Volume resistivity * / >1E13 Ohm*m IEC 60093
Surface resistivity * / >1E15 Ohm IEC 60093
Electric strength * / 37 kV/mm IEC 60243-1
Comparative tracking index * / 125 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 0.8 / * % Sim. to ISO 62
Humidity absorption 0.3 / * % Sim. to ISO 62
Density 1230 / - kg/m³ ISO 1183
Material specific propertiesdry / condUnitTest Standard
Viscosity number 72 / * cm³/g ISO 307, 1157, 1628
Rheological calculation propertiesValueUnitTest Standard
Ejection temperature 165 °C -
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 360 °C ISO 294
Injection Molding, mold temperature 140 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Diagrams
Viscosity-shear rate , Ultrason® S 3010 NAT, PSU, BASF
Shearstress-shear rate , Ultrason® S 3010 NAT, PSU, BASF
Stress-strain , Ultrason® S 3010 NAT, PSU, BASF
Secant modulus-strain , Ultrason® S 3010 NAT, PSU, BASF
Stress-strain (isochronous) 23°C, Ultrason® S 3010 NAT, PSU, BASF
Creep modulus-time 23°C, Ultrason® S 3010 NAT, PSU, BASF
Specific volume-temperature (pvT) , Ultrason® S 3010 NAT, PSU, BASF
Tensile modulus-temperature , Ultrason® S 3010 NAT, PSU, BASF
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Blow Molding, Thermoforming
Delivery form
Pellets
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .02 %
Pre/Post-processing, Pre-drying, Temperature: 140 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
injection molding, Melt temperature, range: 330 - 390 °C
injection molding, Melt temperature, recommended: 350 °C
injection molding, Mold temperature, range: 120 - 160 °C
injection molding, Mold temperature, recommended: 140 °C

Pretreatment
Drying temperature: 130 - 150°C
Drying time: minimum 4h
recommended dryer: vaccum or dry air dryer
maximum moisture: 0,02 - 0,05%

Ultrason® can be injection molded by any type of machinery on the market, provided that the plasticizing unit and the mold temperature control system have been configured appropriately. The machinery manufacturer must be consulted if any doubts exist on the ability of various parts to withstand the high temperatures required (e.g. barrel, barrel head, bolted connections, etc.)

Long residence time in combination with high temperatures should be avoided e.g. by pump out material at regular intervals.
During extended interruptions, the barrel temperature should be lowered to about 250-280°C.

It has been found out that heating to the requested processing temperature and shutting down or lowering the temperature is best carried out in two steps.
First, the barrel temperatures are set at the lower processing temperature range for the particular thermoplastic (340 - 350 °C). As soon as these temperatures have reached a steady state, the material in the barrel is pumped out. Second, the barrel temperature can be set to the required processing temperature or the heaters can be shut down.
Disclaimer
The data contained in this publication are based on our current
knowledge and experience. In view of the many factors that may affect
processing and application of our product, these data do not relieve
processors from carrying out their own investigations and tests. Any
descriptions, drawings, photographs, data, proportions, weights etc.
given herein may change without prior information and do not constitute
the agreed contractual quality of the product. It is the responsibility
of the recipient of our products to ensure that any proprietary rights
and existing laws and legislation are observed. NO WARRANTIES OF ANY
KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WARRANTIES OFMERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, ARE MADE REGARDING PRODUCTS
DESCRIBED OR DESIGNS, DATA OR INFORMATION SET FORTH, OR THAT THE
PRODUCTS, DESIGNS, DATA OR INFORMATION MAY BE USED WITHOUT INFRINGING
THEINTELLECTUAL PROPERTY RIGHTS OF OTHERS.

In order to check the availability of products please contact us or our
sales agency.


For more information about our products contact your local BASF
representative or

BASF SE
Dept. PM/K
Fax: 0621-60-49497
e-mail: e-mail

CAMPUS® is a registered trademark of CWFG (Chemie
Wirtschaftsfoerderungsgesellschaft GmbH, Frankfurt)

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012