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offers extended functionality!CAMPUS® datasheet | VESTAKEEP 2000 GF30
This datasheet of VESTAKEEP 2000 GF30 from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
VESTAKEEP® 2000 GF30 is a medium viscosity, glass fiber reinforced (30%)
polyether ether ketone for injection molding.
The semi-crystalline polymer features superior mechanical, thermal and chemical
resistance.
Parts made from VESTAKEEP® 2000 GF30 are self-extinguishing.
VESTAKEEP® 2000 GF30 can be processed on common injection molding
machines for thermoplastics.
Application example: Parts for the electrical industry,
machinery construction and aerospace.
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 17 | cm³/10min | ISO 1133 |
| Temperature | 380 | °C | ISO 1133 |
| Load | 5 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 0.4 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 0.9 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 11000 | MPa | ISO 527-1/-2 |
| Stress at break | 165 | MPa | ISO 527-1/-2 |
| Strain at break | 2 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 55 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 65 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 9 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 8 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 340 | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 323 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 338 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 335 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 30 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | V-0 | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Oxygen index | 45 | % | ISO 4589-1/-2 |
| Electrical properties | Value | Unit | Test Standard |
| Relative permittivity (100Hz) | 3.3 | - | IEC 60250 |
| Relative permittivity (1MHz) | 3.3 | - | IEC 60250 |
| Dissipation factor (100Hz) | 20 | E-4 | IEC 60250 |
| Dissipation factor (1MHz) | 40 | E-4 | IEC 60250 |
| Volume resistivity | >1E13 | Ohm*m | IEC 60093 |
| Surface resistivity | 1E15 | Ohm | IEC 60093 |
| Comparative tracking index | 200 | - | IEC 60112 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 0.4 | % | Sim. to ISO 62 |
| Density | 1500 | kg/m³ | ISO 1183 |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 380 | °C | ISO 294 |
| Injection Molding, mold temperature | 180 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 120 | MPa | ISO 294 |
PREPROCESSING INFORMATION
Maximum Water Content: 0.25 %
When the water content is exceeded, the resin must be dried.The drying time is dependent on the
drying temperature. In practice a drying time of 2 - 3 hours at a temperature of 150 - 160 °C (depen-
ding on the water content of the resin) has been found to be satisfactory. With the exeption of
fresh air dryers, all conventional dryers can be used.
PROCESSING INFORMATION
| Melt Temperature: | 380 - 400 | °C |
| Mold Temperature: | 160 - 200 | °C |
POSTPROCESSING INFORMATION
Tempering: Temperature: 200 °C
Tempering Time: 2 h
The level of internal strain in injection molded products can be reduced through tempering.
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991