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CAMPUS® datasheet | VESTAMID® DX9304 blk (sw)


This datasheet of VESTAMID® DX9304 blk (sw) from Evonik Industries AG is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® DX9304 blk (sw) | PA612-I | Evonik Industries AG
Product Texts
VESTAMID® DX9304 blk

 

High-viscosity, heat- and light-stabilized, impact-modified polyamide 612 compound for

extrusion

 

Resin: ISO 1874-PA612-HI,EHL,18-020

 

VESTAMID® DX9304 is a PA 612 extrusion compound developed for the manufacturing of tubing

systems with higher demands on heat resistance.

 

The melting point of VESTAMID® DX9304, about 35 °C higher than PA 11 and PA 12 compounds,

allows higher temperatures in use. The compound is especially suitable for the extrusion of tubing

systems that are exposed to high burst pressures at high service temperatures, e.g. hydraulic

clutch lines.

 

The material absorbs only little moisture. Therefore dimensions and properties of parts are nearly

unaffected through ambient conditions.

Rheological propertiesdry / condUnitTest Standard
Molding shrinkage, parallel 2.2 / * % ISO 294-4, 2577
Molding shrinkage, normal 1.4 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 1800 / 1200 MPa ISO 527-1/-2
Yield stress 50 / 41 MPa ISO 527-1/-2
Yield strain 5 / 20 % ISO 527-1/-2
Nominal strain at break >50 / >50 % ISO 527-1/-2
Charpy impact strength, +23°C N / N kJ/m² ISO 179/1eU
Charpy impact strength, -30°C N / N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 50[P] / 95[P] kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 30 / 18 kJ/m² ISO 179/1eA
P: Partial Break   
Thermal propertiesdry / condUnitTest Standard
Melting temperature, 10°C/min 213 / * °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 50 / * °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 170 / * °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 175 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Relative permittivity, 100Hz 4.1 / - - IEC 60250
Relative permittivity, 1MHz 3.2 / - - IEC 60250
Dissipation factor, 100Hz 560 / - E-4 IEC 60250
Dissipation factor, 1MHz 310 / - E-4 IEC 60250
Volume resistivity 1E11 / - Ohm*m IEC 60093
Electric strength 33 / - kV/mm IEC 60243-1
Comparative tracking index 600 / - - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 2.7 / * % Sim. to ISO 62
Humidity absorption 1 / * % Sim. to ISO 62
Density 1040 / 1040 kg/m³ ISO 1183
Characteristics
Processing
Profile Extrusion
Delivery form
Pellets
Special Characteristics
Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
Other text information
Profile extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 240 - 270 °C

Disclaimer
All listed technical data are typical values intended for your guidance.
They are given without obligation and do not constitute a materials
specification. Should you have any further questions concerning material
behavior or properties, please contact us at the following address :

for PA:           Evonik Industries AG
                     PP-HP-CRM
                     Gebäude 1227 / PB 16
                     D-45764 Marl
                     Phone: +49-(0)2365/49-2720
                     Fax:+49-(0)2365/49-2070
                     E-Mail: campusplastics@evonik.com

for PMMA:     Evonik Industries AG
                     Marketing / Campus
                     Kirschenallee
                     D-64293 Darmstadt
                     Germany
                     Phone: +49 - (0) 61 51 / 18-47 11
                     Fax: +49 - (0) 61 51 / 18-31 77
                     E-Mail: campusplastics@evonik.com
                     Internet: http://www.plexiglas-polymers.com

 

® = registered trademark

 

PLEXIGLAS® is a registered trademark of Evonik Röhm GmbH, Germany,

outside of the Americas. Within the Americas it is sold as ACRYLITE®,

which is a registered trademark of Evonik Cyro LLC, USA.

PLEXIMID® is a registered trademarks of Evonik Röhm GmbH, Germany.

CYROLITE® and XT® polymer are registered trademarks of Evonik Cyro LLC, USA.

 

This information and all further technical advice is based on our present knowledge

and experience. However, it implies no liability or other legal responsibility on our part,

including with regard to existing third party intellectual property rights, especially

patent rights. In particular, no warranty, whether express or implied, or guarantee of

product properties in the legal sense is intended or implied. We reserve the right to

make any changes according to technological progress or further developments. The

customer is not released from the obligation to conduct careful inspection and testing

of incoming goods. Performance of the product described herein should be verified by

testing, which should be carried out only by qualified experts in the sole responsibility

of a customer. Reference to trade names used by other companies is neither a

recommendation, nor does it imply that similar products could not be used.

 

NAFTA:

This information and all technical and other advice are based on Evonik’s

present knowledge and experience. However, Evonik assumes no liability for

such information or advice, including the extent to which such information or

advice may relate to third party intellectual property rights. Evonik reserves the

right to make any changes to information or advice at any time, without prior

or subsequent notice. EVONIK DISCLAIMS ALL REPRESENTATIONS AND

WARRANTIES, WHETHER EXPRESS OR IMPLIED, AND SHALL HAVE NO LIABILITY

FOR, MERCHANTABILITY OF THE PRODUCT OR ITS FITNESS FOR A PARTICULAR

PURPOSE (EVEN IF EVONIK IS AWARE OF SUCH PURPOSE), OR OTHERWISE.

EVONIK SHALL NOT BE RESPONSIBLE FOR CONSEQUENTIAL, INDIRECT OR

INCIDENTAL DAMAGES (INCLUDING LOSS OF PROFITS) OF ANY KIND. It is the

customer’s sole responsibility to arrange for inspection and testing of all

products by qualified experts. Reference to trade names used by other

companies is neither a recommendation nor an endorsement of the

corresponding product, and does not imply that similar products could not be

used.

 

Sales range and technical data subject to alteration.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012