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CAMPUS® datasheet | VESTAMID® X7293 blk (sw)


This datasheet of VESTAMID® X7293 blk (sw) from Evonik Industries AG is provided by the international plastics database CAMPUS.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® X7293 blk (sw) | PA12-I | Evonik Industries AG
Product Texts

VESTAMID® X7293 blk


Resin: ISO 1874-PA12-HIP, EHL, 22-004

 

VESTAMID® X7293 is a plasticized polyamide 12 compound with heat and light stabilizer for

the extrusion of flexible tubing and hose, especially for automotive applications according to

DIN 73378, (PA 12-HIPHL, Type 1), ISO/DIS 7628-1 (PA 12-HIPEHL, Type 1) and SAE J844.


VESTAMID® X7293 is distinguished by an easy processing as well as by a high impact strength

at low temperatures. Properties of compounds based on Polyamide 12 vary little with changing

humidity due to low moisture absorption. Parts made of this semicrystalline material are charac-

terized by exceptional impact strength, low coefficient of friction and good chemical resistance.


VESTAMID® X7293 is supplied as cylindrical granules, ready for use, in moisture-proof bags.

Rheological propertiesValueUnitTest Standard
Melt volume-flow rate, MVR 52.9 cm³/10min ISO 1133
Temperature 275 °C ISO 1133
Load 5 kg ISO 1133
Mechanical propertiesValueUnitTest Standard
Tensile Modulus 400 MPa ISO 527-1/-2
Yield stress 27 MPa ISO 527-1/-2
Yield strain 32 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Charpy impact strength, +23°C N kJ/m² ISO 179/1eU
Charpy impact strength, -30°C N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C N kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 7 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
Temp. of deflection under load, 1.80 MPa 45 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 100 °C ISO 75-1/-2
Vicat softening temperature, 50°C/h 50N 130 °C ISO 306
Coeff. of linear therm. expansion, parallel 180 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 180 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm IEC 60695-11-10
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.2 mm IEC 60695-11-10
Electrical propertiesValueUnitTest Standard
Relative permittivity, 100Hz 11 - IEC 60250
Relative permittivity, 1MHz 4.6 - IEC 60250
Dissipation factor, 100Hz 1800 E-4 IEC 60250
Dissipation factor, 1MHz 1900 E-4 IEC 60250
Volume resistivity 1E12 Ohm*m IEC 60093
Electric strength 30 kV/mm IEC 60243-1
Other propertiesValueUnitTest Standard
Humidity absorption 0.6 % Sim. to ISO 62
Density 1020 kg/m³ ISO 1183
Test specimen productionValueUnitTest Standard
Injection Molding, melt temperature 240 °C ISO 294
Injection Molding, mold temperature 80 °C ISO 10724
Injection Molding, injection velocity 200 mm/s ISO 294
Injection Molding, pressure at hold 70 MPa ISO 294
Diagrams
Stress-strain , VESTAMID® X7293 blk (sw), PA12-I, Evonik Industries
Secant modulus-strain , VESTAMID® X7293 blk (sw), PA12-I, Evonik Industries
Tensile modulus-temperature , VESTAMID® X7293 blk (sw), PA12-I, Evonik Industries
Characteristics
Processing
Profile Extrusion, Other Extrusion
Delivery form
Pellets
Additives
Lubricants, Plasticizer
Special Characteristics
Light stabilized or stable to light, U.V. stabilized or stable to weather, Heat stabilized or stable to heat
Regional Availability
Other text information
Other extrusion


PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80°C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer dur ing drying.

PROCESSING INFORMATION
Melt Temperature : 210 - 240 °C

Profile extrusion


PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80°C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plastic izer during drying.

PROCESSING INFORMATION
Melt Temperature : 210 - 240 °C

Disclaimer
All listed technical data are typical values intended for your guidance.
They are given without obligation and do not constitute a materials
specification. Should you have any further questions concerning material
behavior or properties, please contact us at the following address :

for PA:           Evonik Industries AG
                     PP-HP-CRM
                     Gebäude 1227 / PB 16
                     D-45764 Marl
                     Phone: +49-(0)2365/49-2720
                     Fax:+49-(0)2365/49-2070
                     E-Mail: campusplastics@evonik.com

for PMMA:     Evonik Industries AG
                     Marketing / Campus
                     Kirschenallee
                     D-64293 Darmstadt
                     Germany
                     Phone: +49 - (0) 61 51 / 18-47 11
                     Fax: +49 - (0) 61 51 / 18-31 77
                     E-Mail: campusplastics@evonik.com
                     Internet: http://www.plexiglas-polymers.com

 

® = registered trademark

 

PLEXIGLAS® is a registered trademark of Evonik Röhm GmbH, Germany,

outside of the Americas. Within the Americas it is sold as ACRYLITE®,

which is a registered trademark of Evonik Cyro LLC, USA.

PLEXIMID® is a registered trademarks of Evonik Röhm GmbH, Germany.

CYROLITE® and XT® polymer are registered trademarks of Evonik Cyro LLC, USA.

 

This information and all further technical advice is based on our present knowledge

and experience. However, it implies no liability or other legal responsibility on our part,

including with regard to existing third party intellectual property rights, especially

patent rights. In particular, no warranty, whether express or implied, or guarantee of

product properties in the legal sense is intended or implied. We reserve the right to

make any changes according to technological progress or further developments. The

customer is not released from the obligation to conduct careful inspection and testing

of incoming goods. Performance of the product described herein should be verified by

testing, which should be carried out only by qualified experts in the sole responsibility

of a customer. Reference to trade names used by other companies is neither a

recommendation, nor does it imply that similar products could not be used.

 

NAFTA:

This information and all technical and other advice are based on Evonik’s

present knowledge and experience. However, Evonik assumes no liability for

such information or advice, including the extent to which such information or

advice may relate to third party intellectual property rights. Evonik reserves the

right to make any changes to information or advice at any time, without prior

or subsequent notice. EVONIK DISCLAIMS ALL REPRESENTATIONS AND

WARRANTIES, WHETHER EXPRESS OR IMPLIED, AND SHALL HAVE NO LIABILITY

FOR, MERCHANTABILITY OF THE PRODUCT OR ITS FITNESS FOR A PARTICULAR

PURPOSE (EVEN IF EVONIK IS AWARE OF SUCH PURPOSE), OR OTHERWISE.

EVONIK SHALL NOT BE RESPONSIBLE FOR CONSEQUENTIAL, INDIRECT OR

INCIDENTAL DAMAGES (INCLUDING LOSS OF PROFITS) OF ANY KIND. It is the

customer’s sole responsibility to arrange for inspection and testing of all

products by qualified experts. Reference to trade names used by other

companies is neither a recommendation nor an endorsement of the

corresponding product, and does not imply that similar products could not be

used.

 

Sales range and technical data subject to alteration.

The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a registered trademark of CWFG mbH, Frankfurt am Main, 2012