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CAMPUS® datasheet | VESTAMID D26 nc (nf)


This datasheet of VESTAMID D26 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® D26 nc (nf) | PA612 | Evonik Industries AG
Product Texts
VESTAMID® D26 nc

 

High-viskosity PA 612 - grade especially for extrusion.

 

Resin 1874-PA612,LN,22-020

 

The balanced mechanical properties, low water absorption, and low abrasion of filaments made

of VESTAMID® D26 make for industrial applications such as abrasive filaments or high-tech filter

fabrics. Their superior resilience compared to other monofilament materials ensures among others

that the finished bristles do not lose their shape. As a result, the bristles remain fully functional for

a long time.

Rheological propertiesdry / condUnitTest Standard
Molding shrinkage (parallel) 1.6 / * % ISO 294-4, 2577
Molding shrinkage (normal) 1.5 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 2200 / 1700 MPa ISO 527-1/-2
Yield stress 60 / 49 MPa ISO 527-1/-2
Yield strain 4.2 / 4.4 % ISO 527-1/-2
Nominal strain at break >50 / >50 % ISO 527-1/-2
Charpy impact strength (+23°C) N / N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N / N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 8 / 9 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 7 / 7 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 215 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 70 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 180 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 185 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 4.4 / - - IEC 60250
Relative permittivity (1MHz) 3.2 / - - IEC 60250
Dissipation factor (100Hz) 590 / - E-4 IEC 60250
Dissipation factor (1MHz) 380 / - E-4 IEC 60250
Volume resistivity 1E12 / - Ohm*m IEC 60093
Comparative tracking index 600 / - - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 2.7 / * % Sim. to ISO 62
Humidity absorption 1 / * % Sim. to ISO 62
Density 1060 / 1060 kg/m³ ISO 1183
Characteristics
Processing
Other Extrusion
Delivery form
Pellets
Regional Availability
Other text information
Other extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 250 - 270 °C


 

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991