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CAMPUS® datasheet | VESTAMID DX9323 blk (sw)


This datasheet of VESTAMID DX9323 blk (sw) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:

  VESTAMID® DX9323 blk (sw) | PA612-I-GF35 | Evonik Industries AG
Product Texts
VESTAMID® DX9323 blk

 

Heat-stabilized, impact-modified, glass fiber-reinforced molding compound based on

nylon 612 specially suitable for plastic and rubber composites

 

Resin: ISO 1874-PA612-HI,MH,18-090,GF-35

 

VESTAMID® DX9323 black E70228 is a glass fiber-reinforced, impact-modified PA 612 compound.

The material contains about 35 % glass fibers, an ageing protective agent and processing aid for

a fast and even form filling.

VESTAMID® DX9323 black E70228 is especially suitable for the production of plastic and rubber

composites.

 

Parts of VESTAMID® DX9323 black E70228 can be directly bonded to rubber,e.g., XNBR, HNBR,

AEM or FPM, without using any adhesives or adhesion promoters.

 

Because of its semi-crystallinemorphology VESTAMID® DX9323 black E70228 provides an excellent

chemical resistance. e.g., against greases, oils, fuels and hydraulic fluids.

Rheological propertiesdry / condUnitTest Standard
Molding shrinkage (parallel) 0.4 / * % ISO 294-4, 2577
Molding shrinkage (normal) 1.0 / * % ISO 294-4, 2577
Mechanical propertiesdry / condUnitTest Standard
Tensile Modulus 8900 / 7400 MPa ISO 527-1/-2
Stress at break 148 / 126 MPa ISO 527-1/-2
Strain at break 5 / 5 % ISO 527-1/-2
Charpy impact strength (+23°C) 90 / 86 kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) 110 / 97 kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 22 / 21 kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 15 / 14 kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
Melting temperature (10°C/min) 215 / * °C ISO 11357-1/-3
Temp. of deflection under load (1.80 MPa) 196 / * °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 213 / * °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 209 / * °C ISO 306
Burning Behav. at 1.5 mm nom. thickn. HB / * class IEC 60695-11-10
Thickness tested 1.6 / * mm IEC 60695-11-10
Burning Behav. at thickness h HB / * class IEC 60695-11-10
Thickness tested 3.2 / * mm IEC 60695-11-10
Electrical propertiesdry / condUnitTest Standard
Relative permittivity (100Hz) 4.8 / - - IEC 60250
Relative permittivity (1MHz) 3.6 / - - IEC 60250
Dissipation factor (100Hz) 610 / - E-4 IEC 60250
Dissipation factor (1MHz) 320 / - E-4 IEC 60250
Volume resistivity 1E12 / - Ohm*m IEC 60093
Comparative tracking index 600 / - - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 1.9 / * % Sim. to ISO 62
Humidity absorption 0.8 / * % Sim. to ISO 62
Density 1330 / 1330 kg/m³ ISO 1183
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 240 - 270 °C

Mold Temperature : 80 °C

Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!

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CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991