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CAMPUS® datasheet | VESTAMID EX9200 nc (nf)


This datasheet of VESTAMID EX9200 nc (nf) from Evonik Industries AG is provided by the international plastics database CAMPUS.

CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.

You may contact the supplier for more information about this grade.

This datasheet includes:
Rheological properties - Mechanical properties - Thermal properties - Electrical properties - Other properties - Diagrams
  VESTAMID® EX9200 nc (nf) | TPA | Evonik Industries AG
Product Texts
VESTAMID® EX9200 nc


Resin: ISO 1043-1-PEBA  

 

Polyamide 12 elastomer (PEBA = polyether block amide), Shore hardness D = 68.


Application examples:

decorative and protective films for sports articles and interior/exterior designs on

automobiles

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Rheological propertiesValueUnitTest Standard
Molding shrinkage (parallel) 0.7 % ISO 294-4, 2577
Molding shrinkage (normal) 0.6 % ISO 294-4, 2577
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Mechanical propertiesValueUnitTest Standard
Tensile Modulus 750 MPa ISO 527-1/-2
Yield stress 31 MPa ISO 527-1/-2
Yield strain 19 % ISO 527-1/-2
Nominal strain at break >50 % ISO 527-1/-2
Charpy impact strength (+23°C) N kJ/m² ISO 179/1eU
Charpy impact strength (-30°C) N kJ/m² ISO 179/1eU
Charpy notched impact strength (+23°C) 33[P] kJ/m² ISO 179/1eA
Charpy notched impact strength (-30°C) 6 kJ/m² ISO 179/1eA
Shore D hardness (15s) 68 - ISO 868
P: Partial Break
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Thermal propertiesValueUnitTest Standard
Temp. of deflection under load (1.80 MPa) 45 °C ISO 75-1/-2
Temp. of deflection under load (0.45 MPa) 100 °C ISO 75-1/-2
Vicat softening temperature (50°C/h 50N) 130 °C ISO 306
Coeff. of linear therm. expansion (parallel) 160 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion (normal) 160 E-6/K ISO 11359-1/-2
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Electrical propertiesValueUnitTest Standard
Relative permittivity (100Hz) 7.4 - IEC 60250
Relative permittivity (1MHz) 4.6 - IEC 60250
Dissipation factor (100Hz) 1500 E-4 IEC 60250
Dissipation factor (1MHz) 760 E-4 IEC 60250
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Other propertiesValueUnitTest Standard
Density 1010 kg/m³ ISO 1183
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Diagrams
Viscosity-shear rate , VESTAMID® EX9200 nc (nf), TPA, Evonik Degussa
Shearstress-shear rate , VESTAMID® EX9200 nc (nf), TPA, Evonik Degussa
Spec. enthalpy/mass-temp. (DSC) , VESTAMID® EX9200 nc (nf), TPA, Evonik Degussa
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Characteristics
Processing
Film Extrusion
Regional Availability
North America, Europe, Asia Pacific, South and Central America, Near East/Africa
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Other text information
Film extrusion

PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent

on the drying temperature. At a drying temperature of 80 °C we recommend, depending on the water

content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or

vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.


PROCESSING INFORMATION
Melt Temperature : 230 - 260 °C

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Chemical Media Resistance
Acids
Acetic Acid (5% by mass) (23°C)
Citric Acid solution (10% by mass) (23°C)
Bases
Sodium Hydroxide solution (35% by mass) (23°C)
Sodium Hydroxide solution (1% by mass) (23°C)
Ammonium Hydroxide solution (10% by mass) (23°C)
Alcohols
Isopropyl alcohol (23°C)
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
n-Hexane (23°C)
Toluene (23°C)
iso-Octane (23°C)
Ketones
Acetone (23°C)
Ethers
Diethyl ether (23°C)
Salt solutions
Sodium Chloride solution (10% by mass) (23°C)
Sodium Carbonate solution (20% by mass) (23°C)
Sodium Carbonate solution (2% by mass) (23°C)
Other
Ethyl Acetate (23°C)
Hydrogen peroxide (23°C)
Water (23°C)
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Disclaimer
With the following data, which reflect our current knowledge and experience,
we wish to describe possible applications, however this information is given
without guarantee or assurance of the appropriate properties for a specific
application.

The processor is not relieved of the responsibility for incoming quality control
nor from his own testing and analysis.

All data concerning product safety (EG-guideline, BGVV, FDA) are of principle
nature and can be limitied regarding migration, temperature and type of food.
They reflect the status as of Feb. 29, 2012. To insure that this data reflects the
current state, please contact our Product Safety Department.

Should you have any questions, wishes or suggestions about CAMPUS,
please refer to the following address:

  Link to Evonik Industries AG homepage

In any case, we hope you enjoy working with CAMPUS!
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The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991