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offers extended functionality!CAMPUS® datasheet | VESTAMID L-R2-GF25 blk (sw)
This datasheet of VESTAMID L-R2-GF25 blk (sw) from Evonik Industries AG is provided by the international plastics database CAMPUS.
CAMPUS is organized by a group of leading international resin producers, who have agreed to test their material according to uniform conditions, based on ISO standards (ISO 10350, ISO 11403), in order to offer comparable data to the market.
You may contact the supplier for more information about this grade.
VESTAMID® L-R2-GF25 blk (sw) | PA12-GF25 | Evonik Industries AG
Product Texts
VESTAMID® L-R2-GF25 blk
Resin: ISO 1874-PA12,MHZ, 18-070,GF25
Former Designation: VESTAMID® X3692 sw (t)
Glassfiber reinforced (25%), electrically conductive PA12 resin for injection molding.
The resistance values of the finished parts are dependent on the processing conditions.
| Rheological properties | Value | Unit | Test Standard |
| Melt volume-flow rate (MVR) | 80 | cm³/10min | ISO 1133 |
| Temperature | 275 | °C | ISO 1133 |
| Load | 21.6 | kg | ISO 1133 |
| Molding shrinkage (parallel) | 0.3 | % | ISO 294-4, 2577 |
| Molding shrinkage (normal) | 0.8 | % | ISO 294-4, 2577 |
| Mechanical properties | Value | Unit | Test Standard |
| Tensile Modulus | 6500 | MPa | ISO 527-1/-2 |
| Stress at break | 120 | MPa | ISO 527-1/-2 |
| Strain at break | 5 | % | ISO 527-1/-2 |
| Charpy impact strength (+23°C) | 75 | kJ/m² | ISO 179/1eU |
| Charpy impact strength (-30°C) | 70 | kJ/m² | ISO 179/1eU |
| Charpy notched impact strength (+23°C) | 12 | kJ/m² | ISO 179/1eA |
| Charpy notched impact strength (-30°C) | 11 | kJ/m² | ISO 179/1eA |
| Thermal properties | Value | Unit | Test Standard |
| Melting temperature (10°C/min) | 178 | °C | ISO 11357-1/-3 |
| Temp. of deflection under load (1.80 MPa) | 170 | °C | ISO 75-1/-2 |
| Temp. of deflection under load (0.45 MPa) | 175 | °C | ISO 75-1/-2 |
| Vicat softening temperature (50°C/h 50N) | 170 | °C | ISO 306 |
| Coeff. of linear therm. expansion (parallel) | 100 | E-6/K | ISO 11359-1/-2 |
| Coeff. of linear therm. expansion (normal) | 80 | E-6/K | ISO 11359-1/-2 |
| Burning Behav. at 1.5 mm nom. thickn. | HB | class | IEC 60695-11-10 |
| Thickness tested | 1.6 | mm | IEC 60695-11-10 |
| Burning Behav. at thickness h | HB | class | IEC 60695-11-10 |
| Thickness tested | 3.2 | mm | IEC 60695-11-10 |
| Electrical properties | Value | Unit | Test Standard |
| Volume resistivity | 1 | Ohm*m | IEC 60093 |
| Other properties | Value | Unit | Test Standard |
| Water absorption | 1.2 | % | Sim. to ISO 62 |
| Humidity absorption | 0.5 | % | Sim. to ISO 62 |
| Density | 1270 | kg/m³ | ISO 1183 |
| Rheological calculation properties | Value | Unit | Test Standard |
| Density of melt | 1020 | kg/m³ | - |
| Thermal conductivity of melt | 0.24 | W/(m K) | - |
| Spec. heat capacity melt | 2020 | J/(kg K) | - |
| Ejection temperature | 180 | °C | - |
| Test specimen production | Value | Unit | Test Standard |
| Injection Molding, melt temperature | 270 | °C | ISO 294 |
| Injection Molding, mold temperature | 80 | °C | ISO 10724 |
| Injection Molding, injection velocity | 200 | mm/s | ISO 294 |
| Injection Molding, pressure at hold | 70 | MPa | ISO 294 |
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Special Characteristics
Light stabilized or stable to light, Heat stabilized or stable to heat
Regional Availability
Other text information
Injection molding
PREPROCESSING INFORMATION
Maximum Water Content: 0.1 %
When the indicated water content is exceeded, the resin must be dried. The drying time is dependent
on the drying temperature. At a drying temperature of 80°C we recommend, depending on the water
content, a drying time of 8 - 16 hours. Fresh air dryers are acceptable, better would be a dry air or
vacuum dryer. Please note our product literature, plasticized resins can lose plasticizer during drying.
PROCESSING INFORMATION
| Melt Temperature: | 230 - 270 | °C |
| Mold Temperature: | 30 - 100 | °C |
Chemical Media Resistance
Disclaimer
With the following data, which reflect our current knowledge and experience, we wish to describe possible applications, however this information is given without guarantee or assurance of the appropriate properties for a specific application. The processor is not relieved of the responsibility for incoming quality control nor from his own testing and analysis. All data concerning product safety (EG-guideline, BGVV, FDA) are of principle nature and can be limitied regarding migration, temperature and type of food. They reflect the status as of Feb. 29, 2012. To insure that this data reflects the current state, please contact our Product Safety Department. Should you have any questions, wishes or suggestions about CAMPUS, please refer to the following address: Link to Evonik Industries AG homepage In any case, we hope you enjoy working with CAMPUS!
The CAMPUS internet database is hosted by M-Base Engineering + Software GmbH.
M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors.
Any decision about the application of materials must be double checked with the producer of this material.
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991
CAMPUS® is a Registered trademark of CWFG mbH, Frankfurt/Main, 1991